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| | كتاب Advanced Machining Processes - Nontraditional and Hybrid Machining Processes |  |
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| كاتب الموضوع | رسالة |
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Admin
مدير المنتدى
عدد المساهمات : 18996
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تاريخ التسجيل : 01/07/2009
الدولة : مصر
العمل : مدير منتدى هندسة الإنتاج والتصميم الميكانيكى
 | | موضوع: كتاب Advanced Machining Processes - Nontraditional and Hybrid Machining Processes الخميس 11 أبريل 2013, 5:44 pm | |
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تذكير بمساهمة فاتح الموضوع : أخوانى فى الله
أحضرت لكم كتاب
Advanced Machining Processes
Nontraditional and Hybrid Machining Processes
Hassan El-Hofy
Production Engineering Department
Alexandria University, Egypt
و المحتوى كما يلي :
Contents
Preface xi
Acknowledgments xvii
List of Acronyms xix
List of Symbols xxiii
Chapter 1. Material Removal Processes 1
1.1 Introduction 1
1.2 History of Machining 1
1.3 Traditional Machining 5
1.3.1 Machining by cutting 5
1.3.2 Machining by abrasion 6
1.4 Nontraditional Machining 8
1.4.1 Single-action nontraditional machining 9
1.4.2 Hybrid machining 10
References 13
Chapter 2. Mechanical Processes 15
2.1 Ultrasonic Machining 15
2.1.1 Introduction 15
2.1.2 The machining system 15
2.1.3 Material removal process 22
2.1.4 Factors affecting material removal rate 24
2.1.5 Dimensional accuracy and surface quality 26
2.1.6 Applications 28
2.2 Water Jet Machining 32
2.2.1 Introduction 32
2.2.2 The machining system 32
2.2.3 Process parameters 34
2.2.4 Applications 35
2.2.5 Advantages and disadvantages of WJM 38
2.3 Abrasive Jet Machining 39
2.3.1 Introduction 39
2.3.2 Machining system 39
2.3.3 Material removal rate 40
2.3.4 Applications 42
2.3.5 Advantages and limitations of AJM 42
For more information about this title, click hereviii
2.4 Abrasive Water Jet Machining 43
2.4.1 Introduction 43
2.4.2 The machining system 44
2.4.3 Process capabilities 45
2.5 Ice Jet Machining 46
2.5.1 Introduction 46
2.5.2 Process description 46
2.6 Magnetic Abrasive Finishing 48
2.6.1 Introduction 48
2.6.2 The machining system 48
2.6.3 Material removal process 49
2.6.4 Applications 50
References 52
Chapter 3. Chemical Processes 55
3.1 Chemical Milling 55
3.1.1 Introduction 55
3.1.2 Tooling for CHM 57
3.1.3 Process parameters 61
3.1.4 Material removal rate 61
3.1.5 Accuracy and surface finish 62
3.1.6 Advantages 63
3.1.7 Limitations 64
3.1.8 Applications 64
3.2 Photochemical Milling 66
3.2.1 Introduction 66
3.2.2 Process description 66
3.2.3 Applications 67
3.2.4 Advantages 68
3.3 Electropolishing 70
3.3.1 Introduction 70
3.3.2 Process parameters 73
3.3.3 Applications 73
3.3.4 Process limitations 74
References 75
Chapter 4. Electrochemical Processes 77
4.1 Electrochemical Machining 77
4.1.1 Introduction 77
4.1.2 Principles of electrolysis 77
4.1.3 Theory of ECM 78
4.1.4 ECM equipment 79
4.1.5 Basic working principles 84
4.1.6 Process characteristics 87
4.1.7 Process control 95
4.1.8 Applications 97
4.1.9 Micro-ECM 98
4.1.10 Advantages and disadvantages of ECM 98
4.1.11 Environmental impacts 99
4.2 Electrochemical Drilling 100
4.3 Shaped Tube Electrolytic Machining 102
Contentsix
4.4 Electrostream (Capillary) Drilling 105
4.5 Electrochemical Jet Drilling 108
4.6 Electrochemical Deburring 109
References 112
Chapter 5. Thermal Processes 115
5.1 Electrodischarge Machining 115
5.1.1 Introduction 115
5.1.2 Mechanism of material removal 115
5.1.3 The machining system 120
5.1.4 Material removal rates 125
5.1.5 Surface integrity 127
5.1.6 Heat-affected zone 129
5.1.7 Applications 130
5.1.8 Process control 137
5.1.9 EDM automation 138
5.1.10 Environmental impact 139
5.2 Laser Beam Machining 140
5.2.1 Introduction 140
5.2.2 Material removal mechanism 141
5.2.3 Applications 144
5.2.4 Advantages and limitations 156
5.3 Electron Beam Machining 157
5.3.1 Introduction 157
5.3.2 Basic equipment and removal mechanism 157
5.3.3 Applications 163
5.3.4 Advantages and disadvantages 165
5.4 Plasma Beam Machining 166
5.4.1 Introduction 166
5.4.2 Machining systems 166
5.4.3 Material removal rate 169
5.4.4 Accuracy and surface quality 169
5.4.5 Applications 171
5.4.6 Advantages and disadvantages 172
5.5 Ion Beam Machining 172
5.5.1 Introduction 172
5.5.2 Material removal rate 173
5.5.3 Accuracy and surface effects 175
5.5.4 Applications 176
References 177
Chapter 6. Hybrid Electrochemical Processes 181
6.1 Introduction 181
6.2 Electrochemical Grinding 182
6.2.1 Introduction 182
6.2.2 Material removal rate 183
6.2.3 Accuracy and surface quality 187
6.2.4 Applications 188
6.2.5 Advantages and disadvantages 188
6.3 Electrochemical Honing 189
6.3.1 Introduction 189
6.3.2 Process characteristics 189
Contents ix6.3.3 Applications 191
6.4 Electrochemical Superfinishing 192
6.4.1 Introduction 192
6.4.2 Material removal process 193
6.4.3 Process accuracy 195
6.5 Electrochemical Buffing 196
6.5.1 Introduction 196
6.5.2 Material removal process 196
6.6 Ultrasonic-Assisted ECM 197
6.6.1 Introduction 197
6.6.2 Material removal process 198
6.7 Laser-Assisted ECM 199
References 201
Chapter 7. Hybrid Thermal Processes 203
7.1 Introduction 203
7.2 Electroerosion Dissolution Machining 204
7.3 Electrodischarge Grinding 212
7.4 Abrasive Electrodischarge Machining 216
7.5 EDM with Ultrasonic Assistance 218
7.6 Electrochemical Discharge Grinding 221
7.7 Brush Erosion-Dissolution Mechanical Machining 224
References 226
Chapter 8. Material Addition Processes 229
8.1 Introduction 229
8.2 Liquid-Based Techniques 230
8.2.1 Stereolithography 230
8.2.2 Holographic interference solidification 232
8.2.3 Beam interference solidification 232
8.2.4 Solid ground curing 233
8.2.5 Liquid thermal polymerization 235
8.2.6 Fused deposition modeling 235
8.2.7 Multijet modeling 238
8.2.8 Ballistic particles manufacturing 239
8.2.9 Shape deposition manufacturing 240
8.3 Powder-Based Processes 241
8.3.1 Selective laser sintering 241
8.3.2 Laser engineered net shaping 242
8.3.3 Three-dimensional printing 243
8.4 Solid-Based Techniques 244
8.4.1 Solid foil polymerization 244
8.4.2 Laminated object modeling 245
References 246
Index 249
Index
Abrasive machining:
conglomerates, 48, 49
electrodischarge machining, 203, 216
flow machining, 109
grain, 6, 15, 21, 22, 24, 25, 39, 49, 50,
184–186, 194, 198, 215, 216
grit, 29, 183, 189
jet machining, 34, 49
slurry, 9, 16, 17, 21, 24–28, 109, 218
water jet machining, 9, 43, 54, 145
Accuracy:
of ECM, 90
levels, 26, 175, 246
of machined parts, 26, 90
Air plasma, 167, 168, 169, 180
Anodic dissolution, 12, 71, 72, 74, 81,
101, 102, 222, 223
Anodic film, 72
Anodic workpiece, 77, 78, 102, 103, 106,
108, 182, 183, 185
Aspect ratio, 104, 146, 148, 154, 155
Back pressure, 83, 101
Ballistic particles manufacturing,
239, 243
Beam interference solidification,
232, 248
Brass, 15, 23, 54, 73, 84, 121, 123,
144, 153
Brush erosion-dissolution mechanical
machining, 224
Capillary drilling, 105, 108, 109
Cast iron, 82, 95
Cathode, 71, 72, 78, 79, 81, 83, 99, 103,
116–118, 152, 160, 166, 172, 173,
182, 196
Cathodic reactions, 77
Cathodic tool, 78, 83, 87, 93, 100, 102,
103, 105, 106, 183, 189, 190, 192, 198
Ceramics, 6, 8, 35, 39, 41–43, 52, 65, 67,
131, 133, 134, 140, 144, 156,177–179,
197, 201, 214, 229, 239, 242, 245
Chemical blanking, 10, 66
Chemical dissolution, 10–12, 55, 62, 181,
182
Chemical etching, 176, 181
Chemical milling, 10, 55, 56, 66
Chemical processes, 12, 55
Chromium, 21, 37, 144, 150, 162, 175
Composites, 8, 43, 133, 149, 150, 178, 188,
201, 204, 214, 226, 229, 245
Computer-aided design, 46, 66
Computer-integrated manufacturing, 83,
130, 138
Computer keyboard, 154, 179
Computer numerical control, 3, 31,
132, 171
Constant current, 90, 91, 96, 97, 112
Constant feed, 80, 85, 86, 96
Constant gap, 85, 96, 119, 120
Continuous wave, 140
Contour machining, 29, 30, 53
Copper, 21, 38–40, 58, 64, 67, 71, 73, 82,
84, 88, 111, 121, 123, 126, 135, 136,
144, 153, 155, 166, 168, 169, 176,
186, 187, 232, 243
Coring, 28
Crater, 27, 118, 125, 126–128, 134,
151, 152, 203, 206, 208–210,
221, 223
Cubic boron nitride, 133
Current:
density, 71, 72, 73, 82, 84, 88–95, 118,
175, 181, 183, 186, 187, 189, 194–196,
199, 200, 208, 209, 213, 223
249
Copyright  2005 by The McGraw-Hill Companies, Inc. Click here for terms of use.Current: (Conti.)
efficiency, 82–85, 89, 90, 102, 200
flow, 96, 97, 112, 118, 196
lines, 185, 194
Cutting:
of printed circuit boards, 38
rate, 34–36, 41, 45, 46, 146, 168, 169
of rocks, 37
speed, 43, 121, 143, 149, 153, 166,
171, 172
DC power supply, 72, 81, 183, 193, 195,
198, 205, 213, 215, 217–219, 222, 224
Deburring, 37, 40, 42, 44, 52, 74, 79, 97,
99, 109–112, 172
Dielectric fluid, 118, 121, 123, 124, 212,
220, 226
Dielectric flushing, 124, 131, 203, 214
Dielectric liquid, 103, 203
Dielectric type, 134
Die sinking, 91, 99, 115, 131, 132, 139,
140, 226
Dies and molds, 128, 131, 204
Dissolution phase, 10, 181, 194, 195,
197–199, 203, 210, 223
Dressing of grinding wheels, 152, 179
Dynamic balancing, 155
ECD phase, 87, 184, 189, 191, 193, 200,
203, 212, 222, 223
ECG process, 184–186, 188, 201
ECM:
accuracy, 92
equipment, 79
process, 87, 97
EDE phase, 12, 116, 203, 207, 209, 214,
216, 217, 219, 222, 225
EDM:
automation, 138
dielectric, 120, 123
electrodes, 30, 121, 232
milling, 131–133
with ultrasonic assistance, 218
EEDM wire cutting, 205
Electrochemical processes:
arc machining, 203, 226
buffing, 12, 182, 196, 201
deburring, 109, 111
discharge grinding, 13, 203, 221
discharge machining, 203
dissolution, 10, 11, 27, 100, 181, 183,
184, 186, 196, 198, 201, 203,
221, 224, 226
drilling, 91, 100, 145
grinding, 11, 181, 182, 184
honing, 181, 189, 201
jet drilling, 108
machining, 10–12, 75, 77, 78, 88, 97,
112, 113, 145,181, 182, 197, 199, 201,
204, 208, 226
superfinishing, 12, 181, 192
Electrode:
material, 121–123, 132, 224, 225
polarity, 121, 125, 134
wear, 121, 122, 131, 220
Electrodischarge:
erosion, 12, 115, 203, 206, 221, 224
grinding, 136, 203, 212, 214, 226
machining, 9, 10, 15, 130, 145, 177,
203, 204, 216,220, 227
texturing, 128, 134
Electroerosion dissolution machining,
203, 204
Electrolysis, 77, 79, 101, 102, 110,
206, 209
Electrolyte:
concentration, 82, 90, 95
feeding, 79, 83, 96, 101
flow rate, 90, 92, 95, 101, 196, 201, 206
type, 92, 103, 194, 196
velocity, 95, 208
Electrolyzing current, 78, 84
Electron beam machining, 9, 157, 160, 179
Electropolishing, 70–75
Electrostream drilling, 106, 108
Environmental impacts, 46, 99
Equilibrium gap, 86, 87
Erosion phase, 206, 222, 223
Etch factor, 56–58, 60, 61
Etch rate, 58, 61–63, 174
Etchant, 10, 12, 57–60, 63, 66, 67, 70
Evaporation, 118, 143, 152, 154, 158, 203,
218, 223
Faraday’s laws, 77, 85, 88, 101, 110, 184
Feed rate, 35–37, 40, 45, 46, 80, 83, 84,
86, 87, 90, 93, 95–97, 100, 101–105,
112, 130, 171, 186–188, 208–210, 223,
224, 243
Fiber-reinforced plastics, 34, 36, 37, 155
Flushing, 12, 22, 115, 118, 120, 121,
123–125, 178, 182, 203, 209, 214,
219, 220, 226
Fused deposition modeling, 235, 237, 244
Gap:
pressure, 96, 101, 208
short circuit, 87, 208, 220
250 Indexvoltage, 81, 83, 85, 90, 95, 96, 102, 106,
113, 119, 137, 183, 184, 189, 194, 208,
219, 220, 224
width, 90, 92, 93, 115, 119, 183, 186, 205
Graphite, 23, 27, 30, 31, 36, 47, 95,
121–123, 126, 128, 135, 152, 211,
213, 214, 218, 228
Grinding:
action, 187, 221
process, 184
stick, 194
wheels, 7, 152, 179, 186
Grooving, 149, 151, 177, 179
Heat-affected zone, 9, 35, 70, 118, 129,
150, 162, 171, 213
History of machining, 1
Holographic interference solidification,
232
Hybrid electrochemical processes, 182
Hybrid thermal machining, 11, 12,
203, 204
Hydraulic pump, 32
Hydrogen, 59, 64, 79, 99, 101, 168
Ice jet machining, 9, 46, 52
Ignition delay, 117, 210, 220
Insulating ceramics, 133, 134, 179
Integrated circuit, 65, 163, 164
Intensifier, 32, 33, 44
Ion beam machining, 3, 4, 9, 172, 174
Iron, 1, 49, 78, 79, 82, 95, 161
Jet:
cutting nozzle, 33
diameter, 34, 41, 46, 108
machining, 9, 32, 34, 35, 39, 41, 43, 46,
52, 145
velocity, 33, 34, 41
Laminated object modeling, 245
Laser-assisted electrochemical
machining, 11, 181, 199
Laser beam:
drilling, 147
machining, 9, 140, 144, 146
texturing, 151
Liquid-based techniques, 230
Liquid thermal polymerization, 235
Machinability, 4, 6, 23, 75, 83, 89–92,
104, 113, 143, 144, 160–162, 169,
170, 174, 177, 178, 186, 187, 201,
210, 211, 223, 226
Machining:
by abrasion, 6
by cutting, 5, 6, 13, 52, 113, 178, 201
of fiber-reinforced plastics, 36
of spheres, 131
system, 15, 16, 32, 39, 44, 46, 48, 50,
102, 120, 135, 166, 167, 172, 183,
189, 190, 198, 204, 205, 215, 218
Magnetic finishing of:
balls, 50
magnetic tubes, 50
nonmagnetic tubes, 51
rollers, 52
Magnetostrictor, 15–21
MA phase, 185, 222, 225
Maskant, 55, 57–59, 61
Mechanical abrasion, 5, 9–12, 22, 39, 50,
181, 184–186, 189, 190, 193, 194,
197–199, 203, 214, 221–223
Mechanical amplifier, 15, 20
Mechanical machining, 9, 10, 12, 181,
203, 224, 226
Mechanical pulse electrodischarge
machining, 220, 227
Mechanism of material removal, 115,
172, 174
Metallic bond, 183, 185, 189, 192, 193,
214, 215
Metal matrix composites, 149, 178
Micro-ECM, 98, 137, 155, 177
Micro-EDM, 135
Micromachining, 4, 13, 74, 113, 122, 130,
155, 157, 178, 201, 246
Micro ultrasonic machining, 31, 52
Multijet modeling, 238
Nickel, 21, 58, 61, 62–64, 67, 73, 82, 88,
89, 91, 144, 162, 169, 176 187
Nitric acid, 103
Nontraditional machining, 5, 8, 9,
11, 229
Numerical control, 3, 29, 31, 132, 171
Overcut, 26, 80, 83, 100, 101, 103, 108,
130, 186, 187, 214
Oxide film, 89, 90, 102, 185,
193–195, 197
Oxygen, 39, 71, 79, 128, 148–150, 168,
169, 178, 210, 226, 243
Passivation, 12, 85, 90–92, 95, 96, 181,
198, 201, 223
Photochemical milling, 59, 66
Photoresist, 59, 66–68, 175
Index 251Plasma:
arc, 166, 167, 169, 171, 172
beam, 9, 166, 169, 170
channel, 118, 119, 135, 216, 218, 220
jet, 166–169
Polishing, 4, 5, 7, 30, 31, 38, 39, 42, 48,
50–52, 70–75, 91, 109, 128, 172, 176,
196, 218
Powder-based processes, 241
Printed circuit boards, 34, 38, 52
Process:
accuracy, 26, 90, 95, 101, 195
capabilities, 45, 104, 106, 158
characteristics, 41, 42, 87, 189
control, 95, 137
description, 46, 66
parameters, 34, 61, 73, 103, 113, 114,
165, 184, 198
Pulse:
charge, 161, 162
current, 97, 98, 116, 120, 126–128, 134,
135, 206
duration, 127, 138, 142, 146–148, 154,
160, 161, 163, 209
electrochemical machining, 113, 208
energy, 126–128, 147, 148, 161, 162,
210, 223
frequency, 160, 165, 209, 214
on-time, 120, 127
Pulsed power supply, 221
Rapid prototyping, 229, 232, 235,
240, 246
Recast layer, 35, 65, 104, 118, 129, 131,
146, 166, 204
Resolidified layer, 129, 152
Rotary ultrasonic machining, 28, 52
Sapphire, 28, 33, 34, 41, 42
Sawing, 5, 130, 188
Scribing template, 57, 60
Selective laser sintering, 230, 241, 243
Servo controlled feed, 121, 213, 215
Shape deposition manufacturing, 240
Shaped tube electrolytic machining, 102
Shielded plasma, 167–170
Short circuit, 80, 81, 87, 90, 119, 208, 209,
218, 220
Shot blasting, 134, 151
Slotting, 159, 160, 163
Slurry injection methods, 22
Smoothing, 12, 66, 71, 74, 75, 175,
176, 197
Sodium chloride, 78, 81, 82, 189
Sodium nitrate, 81, 82, 189
Solid-based processes, 230
Solid foil polymerization, 244
Solid free-form fabrication, 229, 240
Solid ground curing, 233
Spark:
erosion, 132, 226
gap, 135, 212
machining, 178, 179, 226
Standoff distance, 34, 37, 40, 41, 45
Steels, 1, 35, 61, 62, 95, 106, 111, 168,
169, 186, 187, 218, 226
Stereolithography, 230, 231, 235, 242
Surface:
effects, 175
formation, 93, 208
integrity, 4, 127, 186, 226
quality, 1, 2, 8–10, 12, 24, 26, 27, 35, 37,
46, 50, 62, 64, 73, 83, 92, 93, 95, 99,
101, 123, 125, 160, 162, 169, 181,
187, 188, 197, 199, 206, 209
reflectivity, 147, 165
roughness, 27, 30, 36, 41, 42, 45, 62, 63,
71, 73, 93–95, 111, 126–128, 131, 135,
162, 165, 177, 190, 195, 206, 209,
210, 213, 218, 220, 221, 223
treatment, 38, 43, 177
Texturing, 38, 53, 128, 130, 134, 135, 151,
175, 177, 178, 179
Theory of ECM, 78
Thermal energy method, 109
Thermal properties,125, 143, 146,
160, 161
Thermal machining, 9, 11, 12, 203,
204, 227
Thinning of parts, 65
Three-dimensional printing, 243, 244, 246
Titanium, 23, 39, 58, 59, 61–65, 67, 82,
84, 90, 91, 103, 106, 107, 143, 144,
161, 187, 188, 218, 243
Tool:
design, 83, 96, 113, 138
electrode, 97, 99, 103, 110, 113, 115,
119, 121
feed rate, 83, 95–97, 102, 103
insulation, 84, 90, 101, 111
material, 1, 23, 27, 31, 121, 122, 208
oscillation, 24, 27, 192, 198, 206
shape, 15, 25, 83, 97
wear, 6, 13, 27, 74, 118, 119, 122, 136,
155, 156, 177, 184, 199, 220, 224
252 IndexTooling for CHM, 57
Traditional machining, 5, 8, 35, 67,138, 218
Traditional grinding, 187
Trimming of electronic components, 154
Tungsten, 21, 23, 26, 39, 42, 82, 84, 91,
113, 121, 123, 136, 157, 161, 162, 166,
168, 172, 187, 188, 216, 218
Turbine blade, 29, 104, 106, 130, 163
Turning, 3, 5–7, 83, 99, 112, 138, 139,
151, 167, 169–171
Ultrasonic accuracy, 26
Ultrasonic-assisted electrochemical
machining, 12, 181, 197
Ultrasonic contour machining, 53
Ultrasonic machining, 9, 12, 15, 28, 31,
52, 145, 197, 218
Ultrasonic machining system, 16
Ultrasonic polishing, 30, 31
Ultrasonic sinking, 29
Ultrasonic vibration, 22, 28, 124, 203,
218–220, 227
Vaporization, 109, 134, 141, 142
Volumetric removal rate, 41, 88, 126, 142,
159, 184, 208, 210
Wire:
cutting, 132, 140, 204, 205, 209, 226
EDM, 43, 104, 106, 115, 132, 133, 136,
140, 178
electrodischarge grinding, 136
stripping, 38
Workpiece:
impact hardness, 25
material, 4, 6, 9, 12, 15, 23, 26, 32, 38,
39, 43, 45, 49, 55, 58, 61, 63, 73, 81,
82, 99, 121, 125, 126, 129, 135, 143,
145, 151, 159, 160, 161, 169, 170,
175, 179, 184, 196, 203, 213, 223
shape, 83, 122
Index 253
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|  | |
| كاتب الموضوع | رسالة |
|---|
Admin
مدير المنتدى
عدد المساهمات : 18996
تاريخ التسجيل : 01/07/2009
| | موضوع: كتاب Advanced Machining Processes - Nontraditional and Hybrid Machining Processes الخميس 11 أبريل 2013, 5:44 pm | |
|
أخوانى فى الله
أحضرت لكم كتاب
Advanced Machining Processes
Nontraditional and Hybrid Machining Processes
Hassan El-Hofy
Production Engineering Department
Alexandria University, Egypt
و المحتوى كما يلي :
Contents
Preface xi
Acknowledgments xvii
List of Acronyms xix
List of Symbols xxiii
Chapter 1. Material Removal Processes 1
1.1 Introduction 1
1.2 History of Machining 1
1.3 Traditional Machining 5
1.3.1 Machining by cutting 5
1.3.2 Machining by abrasion 6
1.4 Nontraditional Machining 8
1.4.1 Single-action nontraditional machining 9
1.4.2 Hybrid machining 10
References 13
Chapter 2. Mechanical Processes 15
2.1 Ultrasonic Machining 15
2.1.1 Introduction 15
2.1.2 The machining system 15
2.1.3 Material removal process 22
2.1.4 Factors affecting material removal rate 24
2.1.5 Dimensional accuracy and surface quality 26
2.1.6 Applications 28
2.2 Water Jet Machining 32
2.2.1 Introduction 32
2.2.2 The machining system 32
2.2.3 Process parameters 34
2.2.4 Applications 35
2.2.5 Advantages and disadvantages of WJM 38
2.3 Abrasive Jet Machining 39
2.3.1 Introduction 39
2.3.2 Machining system 39
2.3.3 Material removal rate 40
2.3.4 Applications 42
2.3.5 Advantages and limitations of AJM 42
For more information about this title, click hereviii
2.4 Abrasive Water Jet Machining 43
2.4.1 Introduction 43
2.4.2 The machining system 44
2.4.3 Process capabilities 45
2.5 Ice Jet Machining 46
2.5.1 Introduction 46
2.5.2 Process description 46
2.6 Magnetic Abrasive Finishing 48
2.6.1 Introduction 48
2.6.2 The machining system 48
2.6.3 Material removal process 49
2.6.4 Applications 50
References 52
Chapter 3. Chemical Processes 55
3.1 Chemical Milling 55
3.1.1 Introduction 55
3.1.2 Tooling for CHM 57
3.1.3 Process parameters 61
3.1.4 Material removal rate 61
3.1.5 Accuracy and surface finish 62
3.1.6 Advantages 63
3.1.7 Limitations 64
3.1.8 Applications 64
3.2 Photochemical Milling 66
3.2.1 Introduction 66
3.2.2 Process description 66
3.2.3 Applications 67
3.2.4 Advantages 68
3.3 Electropolishing 70
3.3.1 Introduction 70
3.3.2 Process parameters 73
3.3.3 Applications 73
3.3.4 Process limitations 74
References 75
Chapter 4. Electrochemical Processes 77
4.1 Electrochemical Machining 77
4.1.1 Introduction 77
4.1.2 Principles of electrolysis 77
4.1.3 Theory of ECM 78
4.1.4 ECM equipment 79
4.1.5 Basic working principles 84
4.1.6 Process characteristics 87
4.1.7 Process control 95
4.1.8 Applications 97
4.1.9 Micro-ECM 98
4.1.10 Advantages and disadvantages of ECM 98
4.1.11 Environmental impacts 99
4.2 Electrochemical Drilling 100
4.3 Shaped Tube Electrolytic Machining 102
Contentsix
4.4 Electrostream (Capillary) Drilling 105
4.5 Electrochemical Jet Drilling 108
4.6 Electrochemical Deburring 109
References 112
Chapter 5. Thermal Processes 115
5.1 Electrodischarge Machining 115
5.1.1 Introduction 115
5.1.2 Mechanism of material removal 115
5.1.3 The machining system 120
5.1.4 Material removal rates 125
5.1.5 Surface integrity 127
5.1.6 Heat-affected zone 129
5.1.7 Applications 130
5.1.8 Process control 137
5.1.9 EDM automation 138
5.1.10 Environmental impact 139
5.2 Laser Beam Machining 140
5.2.1 Introduction 140
5.2.2 Material removal mechanism 141
5.2.3 Applications 144
5.2.4 Advantages and limitations 156
5.3 Electron Beam Machining 157
5.3.1 Introduction 157
5.3.2 Basic equipment and removal mechanism 157
5.3.3 Applications 163
5.3.4 Advantages and disadvantages 165
5.4 Plasma Beam Machining 166
5.4.1 Introduction 166
5.4.2 Machining systems 166
5.4.3 Material removal rate 169
5.4.4 Accuracy and surface quality 169
5.4.5 Applications 171
5.4.6 Advantages and disadvantages 172
5.5 Ion Beam Machining 172
5.5.1 Introduction 172
5.5.2 Material removal rate 173
5.5.3 Accuracy and surface effects 175
5.5.4 Applications 176
References 177
Chapter 6. Hybrid Electrochemical Processes 181
6.1 Introduction 181
6.2 Electrochemical Grinding 182
6.2.1 Introduction 182
6.2.2 Material removal rate 183
6.2.3 Accuracy and surface quality 187
6.2.4 Applications 188
6.2.5 Advantages and disadvantages 188
6.3 Electrochemical Honing 189
6.3.1 Introduction 189
6.3.2 Process characteristics 189
Contents ix6.3.3 Applications 191
6.4 Electrochemical Superfinishing 192
6.4.1 Introduction 192
6.4.2 Material removal process 193
6.4.3 Process accuracy 195
6.5 Electrochemical Buffing 196
6.5.1 Introduction 196
6.5.2 Material removal process 196
6.6 Ultrasonic-Assisted ECM 197
6.6.1 Introduction 197
6.6.2 Material removal process 198
6.7 Laser-Assisted ECM 199
References 201
Chapter 7. Hybrid Thermal Processes 203
7.1 Introduction 203
7.2 Electroerosion Dissolution Machining 204
7.3 Electrodischarge Grinding 212
7.4 Abrasive Electrodischarge Machining 216
7.5 EDM with Ultrasonic Assistance 218
7.6 Electrochemical Discharge Grinding 221
7.7 Brush Erosion-Dissolution Mechanical Machining 224
References 226
Chapter 8. Material Addition Processes 229
8.1 Introduction 229
8.2 Liquid-Based Techniques 230
8.2.1 Stereolithography 230
8.2.2 Holographic interference solidification 232
8.2.3 Beam interference solidification 232
8.2.4 Solid ground curing 233
8.2.5 Liquid thermal polymerization 235
8.2.6 Fused deposition modeling 235
8.2.7 Multijet modeling 238
8.2.8 Ballistic particles manufacturing 239
8.2.9 Shape deposition manufacturing 240
8.3 Powder-Based Processes 241
8.3.1 Selective laser sintering 241
8.3.2 Laser engineered net shaping 242
8.3.3 Three-dimensional printing 243
8.4 Solid-Based Techniques 244
8.4.1 Solid foil polymerization 244
8.4.2 Laminated object modeling 245
References 246
Index 249
Index
Abrasive machining:
conglomerates, 48, 49
electrodischarge machining, 203, 216
flow machining, 109
grain, 6, 15, 21, 22, 24, 25, 39, 49, 50,
184–186, 194, 198, 215, 216
grit, 29, 183, 189
jet machining, 34, 49
slurry, 9, 16, 17, 21, 24–28, 109, 218
water jet machining, 9, 43, 54, 145
Accuracy:
of ECM, 90
levels, 26, 175, 246
of machined parts, 26, 90
Air plasma, 167, 168, 169, 180
Anodic dissolution, 12, 71, 72, 74, 81,
101, 102, 222, 223
Anodic film, 72
Anodic workpiece, 77, 78, 102, 103, 106,
108, 182, 183, 185
Aspect ratio, 104, 146, 148, 154, 155
Back pressure, 83, 101
Ballistic particles manufacturing,
239, 243
Beam interference solidification,
232, 248
Brass, 15, 23, 54, 73, 84, 121, 123,
144, 153
Brush erosion-dissolution mechanical
machining, 224
Capillary drilling, 105, 108, 109
Cast iron, 82, 95
Cathode, 71, 72, 78, 79, 81, 83, 99, 103,
116–118, 152, 160, 166, 172, 173,
182, 196
Cathodic reactions, 77
Cathodic tool, 78, 83, 87, 93, 100, 102,
103, 105, 106, 183, 189, 190, 192, 198
Ceramics, 6, 8, 35, 39, 41–43, 52, 65, 67,
131, 133, 134, 140, 144, 156,177–179,
197, 201, 214, 229, 239, 242, 245
Chemical blanking, 10, 66
Chemical dissolution, 10–12, 55, 62, 181,
182
Chemical etching, 176, 181
Chemical milling, 10, 55, 56, 66
Chemical processes, 12, 55
Chromium, 21, 37, 144, 150, 162, 175
Composites, 8, 43, 133, 149, 150, 178, 188,
201, 204, 214, 226, 229, 245
Computer-aided design, 46, 66
Computer-integrated manufacturing, 83,
130, 138
Computer keyboard, 154, 179
Computer numerical control, 3, 31,
132, 171
Constant current, 90, 91, 96, 97, 112
Constant feed, 80, 85, 86, 96
Constant gap, 85, 96, 119, 120
Continuous wave, 140
Contour machining, 29, 30, 53
Copper, 21, 38–40, 58, 64, 67, 71, 73, 82,
84, 88, 111, 121, 123, 126, 135, 136,
144, 153, 155, 166, 168, 169, 176,
186, 187, 232, 243
Coring, 28
Crater, 27, 118, 125, 126–128, 134,
151, 152, 203, 206, 208–210,
221, 223
Cubic boron nitride, 133
Current:
density, 71, 72, 73, 82, 84, 88–95, 118,
175, 181, 183, 186, 187, 189, 194–196,
199, 200, 208, 209, 213, 223
249
Copyright 2005 by The McGraw-Hill Companies, Inc. Click here for terms of use.Current: (Conti.)
efficiency, 82–85, 89, 90, 102, 200
flow, 96, 97, 112, 118, 196
lines, 185, 194
Cutting:
of printed circuit boards, 38
rate, 34–36, 41, 45, 46, 146, 168, 169
of rocks, 37
speed, 43, 121, 143, 149, 153, 166,
171, 172
DC power supply, 72, 81, 183, 193, 195,
198, 205, 213, 215, 217–219, 222, 224
Deburring, 37, 40, 42, 44, 52, 74, 79, 97,
99, 109–112, 172
Dielectric fluid, 118, 121, 123, 124, 212,
220, 226
Dielectric flushing, 124, 131, 203, 214
Dielectric liquid, 103, 203
Dielectric type, 134
Die sinking, 91, 99, 115, 131, 132, 139,
140, 226
Dies and molds, 128, 131, 204
Dissolution phase, 10, 181, 194, 195,
197–199, 203, 210, 223
Dressing of grinding wheels, 152, 179
Dynamic balancing, 155
ECD phase, 87, 184, 189, 191, 193, 200,
203, 212, 222, 223
ECG process, 184–186, 188, 201
ECM:
accuracy, 92
equipment, 79
process, 87, 97
EDE phase, 12, 116, 203, 207, 209, 214,
216, 217, 219, 222, 225
EDM:
automation, 138
dielectric, 120, 123
electrodes, 30, 121, 232
milling, 131–133
with ultrasonic assistance, 218
EEDM wire cutting, 205
Electrochemical processes:
arc machining, 203, 226
buffing, 12, 182, 196, 201
deburring, 109, 111
discharge grinding, 13, 203, 221
discharge machining, 203
dissolution, 10, 11, 27, 100, 181, 183,
184, 186, 196, 198, 201, 203,
221, 224, 226
drilling, 91, 100, 145
grinding, 11, 181, 182, 184
honing, 181, 189, 201
jet drilling, 108
machining, 10–12, 75, 77, 78, 88, 97,
112, 113, 145,181, 182, 197, 199, 201,
204, 208, 226
superfinishing, 12, 181, 192
Electrode:
material, 121–123, 132, 224, 225
polarity, 121, 125, 134
wear, 121, 122, 131, 220
Electrodischarge:
erosion, 12, 115, 203, 206, 221, 224
grinding, 136, 203, 212, 214, 226
machining, 9, 10, 15, 130, 145, 177,
203, 204, 216,220, 227
texturing, 128, 134
Electroerosion dissolution machining,
203, 204
Electrolysis, 77, 79, 101, 102, 110,
206, 209
Electrolyte:
concentration, 82, 90, 95
feeding, 79, 83, 96, 101
flow rate, 90, 92, 95, 101, 196, 201, 206
type, 92, 103, 194, 196
velocity, 95, 208
Electrolyzing current, 78, 84
Electron beam machining, 9, 157, 160, 179
Electropolishing, 70–75
Electrostream drilling, 106, 108
Environmental impacts, 46, 99
Equilibrium gap, 86, 87
Erosion phase, 206, 222, 223
Etch factor, 56–58, 60, 61
Etch rate, 58, 61–63, 174
Etchant, 10, 12, 57–60, 63, 66, 67, 70
Evaporation, 118, 143, 152, 154, 158, 203,
218, 223
Faraday’s laws, 77, 85, 88, 101, 110, 184
Feed rate, 35–37, 40, 45, 46, 80, 83, 84,
86, 87, 90, 93, 95–97, 100, 101–105,
112, 130, 171, 186–188, 208–210, 223,
224, 243
Fiber-reinforced plastics, 34, 36, 37, 155
Flushing, 12, 22, 115, 118, 120, 121,
123–125, 178, 182, 203, 209, 214,
219, 220, 226
Fused deposition modeling, 235, 237, 244
Gap:
pressure, 96, 101, 208
short circuit, 87, 208, 220
250 Indexvoltage, 81, 83, 85, 90, 95, 96, 102, 106,
113, 119, 137, 183, 184, 189, 194, 208,
219, 220, 224
width, 90, 92, 93, 115, 119, 183, 186, 205
Graphite, 23, 27, 30, 31, 36, 47, 95,
121–123, 126, 128, 135, 152, 211,
213, 214, 218, 228
Grinding:
action, 187, 221
process, 184
stick, 194
wheels, 7, 152, 179, 186
Grooving, 149, 151, 177, 179
Heat-affected zone, 9, 35, 70, 118, 129,
150, 162, 171, 213
History of machining, 1
Holographic interference solidification,
232
Hybrid electrochemical processes, 182
Hybrid thermal machining, 11, 12,
203, 204
Hydraulic pump, 32
Hydrogen, 59, 64, 79, 99, 101, 168
Ice jet machining, 9, 46, 52
Ignition delay, 117, 210, 220
Insulating ceramics, 133, 134, 179
Integrated circuit, 65, 163, 164
Intensifier, 32, 33, 44
Ion beam machining, 3, 4, 9, 172, 174
Iron, 1, 49, 78, 79, 82, 95, 161
Jet:
cutting nozzle, 33
diameter, 34, 41, 46, 108
machining, 9, 32, 34, 35, 39, 41, 43, 46,
52, 145
velocity, 33, 34, 41
Laminated object modeling, 245
Laser-assisted electrochemical
machining, 11, 181, 199
Laser beam:
drilling, 147
machining, 9, 140, 144, 146
texturing, 151
Liquid-based techniques, 230
Liquid thermal polymerization, 235
Machinability, 4, 6, 23, 75, 83, 89–92,
104, 113, 143, 144, 160–162, 169,
170, 174, 177, 178, 186, 187, 201,
210, 211, 223, 226
Machining:
by abrasion, 6
by cutting, 5, 6, 13, 52, 113, 178, 201
of fiber-reinforced plastics, 36
of spheres, 131
system, 15, 16, 32, 39, 44, 46, 48, 50,
102, 120, 135, 166, 167, 172, 183,
189, 190, 198, 204, 205, 215, 218
Magnetic finishing of:
balls, 50
magnetic tubes, 50
nonmagnetic tubes, 51
rollers, 52
Magnetostrictor, 15–21
MA phase, 185, 222, 225
Maskant, 55, 57–59, 61
Mechanical abrasion, 5, 9–12, 22, 39, 50,
181, 184–186, 189, 190, 193, 194,
197–199, 203, 214, 221–223
Mechanical amplifier, 15, 20
Mechanical machining, 9, 10, 12, 181,
203, 224, 226
Mechanical pulse electrodischarge
machining, 220, 227
Mechanism of material removal, 115,
172, 174
Metallic bond, 183, 185, 189, 192, 193,
214, 215
Metal matrix composites, 149, 178
Micro-ECM, 98, 137, 155, 177
Micro-EDM, 135
Micromachining, 4, 13, 74, 113, 122, 130,
155, 157, 178, 201, 246
Micro ultrasonic machining, 31, 52
Multijet modeling, 238
Nickel, 21, 58, 61, 62–64, 67, 73, 82, 88,
89, 91, 144, 162, 169, 176 187
Nitric acid, 103
Nontraditional machining, 5, 8, 9,
11, 229
Numerical control, 3, 29, 31, 132, 171
Overcut, 26, 80, 83, 100, 101, 103, 108,
130, 186, 187, 214
Oxide film, 89, 90, 102, 185,
193–195, 197
Oxygen, 39, 71, 79, 128, 148–150, 168,
169, 178, 210, 226, 243
Passivation, 12, 85, 90–92, 95, 96, 181,
198, 201, 223
Photochemical milling, 59, 66
Photoresist, 59, 66–68, 175
Index 251Plasma:
arc, 166, 167, 169, 171, 172
beam, 9, 166, 169, 170
channel, 118, 119, 135, 216, 218, 220
jet, 166–169
Polishing, 4, 5, 7, 30, 31, 38, 39, 42, 48,
50–52, 70–75, 91, 109, 128, 172, 176,
196, 218
Powder-based processes, 241
Printed circuit boards, 34, 38, 52
Process:
accuracy, 26, 90, 95, 101, 195
capabilities, 45, 104, 106, 158
characteristics, 41, 42, 87, 189
control, 95, 137
description, 46, 66
parameters, 34, 61, 73, 103, 113, 114,
165, 184, 198
Pulse:
charge, 161, 162
current, 97, 98, 116, 120, 126–128, 134,
135, 206
duration, 127, 138, 142, 146–148, 154,
160, 161, 163, 209
electrochemical machining, 113, 208
energy, 126–128, 147, 148, 161, 162,
210, 223
frequency, 160, 165, 209, 214
on-time, 120, 127
Pulsed power supply, 221
Rapid prototyping, 229, 232, 235,
240, 246
Recast layer, 35, 65, 104, 118, 129, 131,
146, 166, 204
Resolidified layer, 129, 152
Rotary ultrasonic machining, 28, 52
Sapphire, 28, 33, 34, 41, 42
Sawing, 5, 130, 188
Scribing template, 57, 60
Selective laser sintering, 230, 241, 243
Servo controlled feed, 121, 213, 215
Shape deposition manufacturing, 240
Shaped tube electrolytic machining, 102
Shielded plasma, 167–170
Short circuit, 80, 81, 87, 90, 119, 208, 209,
218, 220
Shot blasting, 134, 151
Slotting, 159, 160, 163
Slurry injection methods, 22
Smoothing, 12, 66, 71, 74, 75, 175,
176, 197
Sodium chloride, 78, 81, 82, 189
Sodium nitrate, 81, 82, 189
Solid-based processes, 230
Solid foil polymerization, 244
Solid free-form fabrication, 229, 240
Solid ground curing, 233
Spark:
erosion, 132, 226
gap, 135, 212
machining, 178, 179, 226
Standoff distance, 34, 37, 40, 41, 45
Steels, 1, 35, 61, 62, 95, 106, 111, 168,
169, 186, 187, 218, 226
Stereolithography, 230, 231, 235, 242
Surface:
effects, 175
formation, 93, 208
integrity, 4, 127, 186, 226
quality, 1, 2, 8–10, 12, 24, 26, 27, 35, 37,
46, 50, 62, 64, 73, 83, 92, 93, 95, 99,
101, 123, 125, 160, 162, 169, 181,
187, 188, 197, 199, 206, 209
reflectivity, 147, 165
roughness, 27, 30, 36, 41, 42, 45, 62, 63,
71, 73, 93–95, 111, 126–128, 131, 135,
162, 165, 177, 190, 195, 206, 209,
210, 213, 218, 220, 221, 223
treatment, 38, 43, 177
Texturing, 38, 53, 128, 130, 134, 135, 151,
175, 177, 178, 179
Theory of ECM, 78
Thermal energy method, 109
Thermal properties,125, 143, 146,
160, 161
Thermal machining, 9, 11, 12, 203,
204, 227
Thinning of parts, 65
Three-dimensional printing, 243, 244, 246
Titanium, 23, 39, 58, 59, 61–65, 67, 82,
84, 90, 91, 103, 106, 107, 143, 144,
161, 187, 188, 218, 243
Tool:
design, 83, 96, 113, 138
electrode, 97, 99, 103, 110, 113, 115,
119, 121
feed rate, 83, 95–97, 102, 103
insulation, 84, 90, 101, 111
material, 1, 23, 27, 31, 121, 122, 208
oscillation, 24, 27, 192, 198, 206
shape, 15, 25, 83, 97
wear, 6, 13, 27, 74, 118, 119, 122, 136,
155, 156, 177, 184, 199, 220, 224
252 IndexTooling for CHM, 57
Traditional machining, 5, 8, 35, 67,138, 218
Traditional grinding, 187
Trimming of electronic components, 154
Tungsten, 21, 23, 26, 39, 42, 82, 84, 91,
113, 121, 123, 136, 157, 161, 162, 166,
168, 172, 187, 188, 216, 218
Turbine blade, 29, 104, 106, 130, 163
Turning, 3, 5–7, 83, 99, 112, 138, 139,
151, 167, 169–171
Ultrasonic accuracy, 26
Ultrasonic-assisted electrochemical
machining, 12, 181, 197
Ultrasonic contour machining, 53
Ultrasonic machining, 9, 12, 15, 28, 31,
52, 145, 197, 218
Ultrasonic machining system, 16
Ultrasonic polishing, 30, 31
Ultrasonic sinking, 29
Ultrasonic vibration, 22, 28, 124, 203,
218–220, 227
Vaporization, 109, 134, 141, 142
Volumetric removal rate, 41, 88, 126, 142,
159, 184, 208, 210
Wire:
cutting, 132, 140, 204, 205, 209, 226
EDM, 43, 104, 106, 115, 132, 133, 136,
140, 178
electrodischarge grinding, 136
stripping, 38
Workpiece:
impact hardness, 25
material, 4, 6, 9, 12, 15, 23, 26, 32, 38,
39, 43, 45, 49, 55, 58, 61, 63, 73, 81,
82, 99, 121, 125, 126, 129, 135, 143,
145, 151, 159, 160, 161, 169, 170,
175, 179, 184, 196, 203, 213, 223
shape, 83, 122
Index 253
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