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أخوانى فى الله أحضرت لكم كتاب Non-traditional Micromachining - Processes Fundamentals and Applications Materials Forming, Machining and Tribology Golam Kibria , B. Bhattacharyya , J. Paulo Davim Editors
![كتاب Non-traditional Micromachining - Processes Fundamentals and Applications N_t_m_10](https://i.servimg.com/u/f61/15/36/74/14/n_t_m_10.jpg) و المحتوى كما يلي :
Contents 1 Non-traditional Micromachining Processes: Opportunities and Challenges 1 S. Debnath, S. Kunar, S.S. Anasane and B. Bhattacharyya 2 Recent Advancement on Ultrasonic Micro Machining (USMM) Process . 61 S. Das, B. Doloi and B. Bhattacharyya 3 Electrical Discharge Micro-hole Machining Process of Ti–6Al–4V: Improvement of Accuracy and Performance 93 Golam Kibria, I. Shivakoti, B.B. Pradhan and B. Bhattacharyya 4 Advancements in Micro Wire-cut Electrical Discharge Machining 145 Asit Baran Puri 5 Laser Micro-turning Process of Aluminium Oxide Ceramic Using Pulsed Nd:YAG Laser . 179 Golam Kibria, B. Doloi and B. Bhattacharyya 6 Fiber Laser Micro-machining of Engineering Materials 227 A. Sen, B. Doloi and B. Bhattacharyya 7 Laser Beam Micro-cutting . 253 N. Roy, A.S. Kuar and S. Mitra 8 Electrochemical Micromachining (EMM): Fundamentals and Applications . 275 V. Rathod, B. Doloi and B. Bhattacharyya 9 Electrochemical Micromachining of Titanium and Its Alloys 337 Sandip S. Anasane and B. Bhattacharyya xi10 Electrochemical Discharge Micro-machining of Engineering Materials . 367 B.R. Sarkar, B. Doloi and B. Bhattacharyya 11 Travelling Wire Electrochemical Spark Machining: An Overview 393 Anup Malik and Alakesh Manna Index 413 Index A Abrasive assisted Micromachining (AM), 43 Abrasive Flow Finishing (AFF), 8, 46 Abrasive flow rate, 44 Abrasive grains, 11, 17 Abrasive grit size, 10 Abrasive Jet Machining (AJM), 4 Abrasive particle, 81 Abrasive slurry, 15, 44, 69, 89 Abrasive Slurry Jet Micro-machining (ASJM), 43 Abrasive Water Jet Machining (AWJM), 371 Absorptivity, 24 Accumulation of sludge, 351 Accuracy, 41 Acidic electrolyte, 284 Actuation, 5 Adaptive control, 159 Adequate laser energy, 214 Adequate surface finish, 62 Adhesion of carbon, 117 Advanced ceramics, 181 Aerospace, 111 AFM, 30 Aggressive anions, 37 Aircraft floors, 342 Al/Al2O3-MMC, 245 Alkaline chemical reagent, 34 Alkaline electrolyte, 284 Alloy steel, 7 Altered Material Zones (AMZ), 172 Alumina, 15 Aluminium oxide, 9, 79 Amorphous oxide, 349 Amplitude, 115 Analysis of variance, 197 Anode and shaped tool, 277 Anodic dissolution, 4, 279 Anodic workpiece, 38 Aqueous solution, 348 Arcing state, 115 Aspect ratio, 183 Assist air pressure, 192 Atomic weight, 290 Attenuation for minimizing, 24 Automotive, 111 Auxiliary electrode, 369, 384, 395 Axial feed, 180 Axial feed rate, 187 B Beam gun, 32 Beam polarization, 263 Beam scanning speed, 186 Beer-Lambert law, 256 Bi-metal, 33 Biocompatibility, 363 Biomedical, 94 Bio-medical applications, 232 Biomedical implants, 186, 332 Biomedicine, 327 Black sand, 340 Bond energy, 263 Boron carbide, 15, 79, 117 Borosilicate glass, 18, 21 Brazing or soft soldering, 17 Breakdown of oxide film, 349 Breakdown strength of the dielectric and IEG, 99 Breakdown voltage (Vb), 147, 155 Brittle fracture, 9, 74 Brittleness properties, 185 Building block, 255 Burrs free surfaces, 280 C Capability, 48 Capillary electrophoresis, 43
Springer International Publishing AG 2017 G. Kibria et al. (eds.), Non-traditional Micromachining Processes, Materials Forming, Machining and Tribology, DOI 10.1007/978-3-319-52009-4 413Capillary tube, 28 Carbide, 7, 15 Carbon Fiber Reinforced Polymer (CFRP), 240 Cathode, 12 Cations, 282 Cavitation, 18, 89, 111 Cavitations effect, 316 Ceramic bearing ring, 180 Ceramics, 7, 51 Ceramic spikes, 180 Changing polarity, 136 Charge Couple Device Camera (CCD), 237 Charging loop, 155 Chemical Dissolution (CD), 4 Chemical Machining (CHM), 4 Chemical reaction, 18 Chipping, 71 Chirped Pulse Amplification (CPA), 231 Circumferential direction, 201 Circumferential Overlap (COp), 186 Cladding, 228 Cleaning and descaling, 9 Close tolerances, 276 CMM, 12 CMP process, 47 CNC EBM, 33 CO and CH4, 117 Coatings, 4 CO2 lasers, 227 Cold emission, 148 Collet, 189 Collimator, 237 Colloidal suspension, 148 Commercially Pure, 111 Complex features, 3 Complex micro structures, 398 Complex part geometries, 276 Composite materials, 39 Composites, 51 Composition, 13 Compressive pressure wave, 148 Computer Numerical Controlled (CNC), 307 Concentration, 16 Conical microtool, 311, 317, 318 Conjugate image, 64 Consecutive laser scanned widths, 208 Contour grinding, 4 Controllability, 50 Controlled anodic dissolution, 276 Controlled dissolution, 4 Controlled fracture technique, 258 Control unit, 97 Conventional turning, 65 Cooling ability, 149 Cooling blade, 6 Cooling holes, 183 Corner radius, 169 Corrosion resistant, 62, 111 Corrosive electrolyte, 13 Counter electrode, 394 Coupler, 78 Coupling laser beam, 234 Crevice, 111 Crosstalk, 151 Crystallographic, 356 Crystallographic damage, 49 Current distribution, 291 Current efficiency, 290, 297 Cutting front, 182 Cycloid, 168 Cylindrical microtools, 311 D Damp proof structure, 303 3D cavities, 16 Debri particles, 95 Debris, 175 Debris formation, 246 Decarburized, 35 Decreasing load, 71 Deep cut, 263 Deep ultraviolet, 261 Defect, 75 Defocusing, 211 Defocusing positions, 191 Degree of dissociation, 300 De-ionized water, 117, 121, 149 Density, 101 Deposition, 29 Depth deviation, 199 Desirability Function (D), 271 Desired precision, 25 Deteriorate, 36 Detrimental thermal effect, 32 Diameteral difference, 104 Diameteral variance, 126 Diameteral variance at entry and exit hole, 104 Diamond, 7 Dielectric, 22 Dielectric chamber, 126 Dielectric circulating unit, 97 Dielectric fluid, 96, 97 Dielectric fluid circulation, 107 Dielectric flushing pressure, 96 Dielectric jet, 109 Dielectric medium, 149 Dielectric pumping, 117 Dielectric strength, 101 414 IndexDie-sinking tool, 106 Difficult-to-cut, 11 Difficult-to-cut materials, 7 Diffusion and convection, 354 Diffusion layer, 316 Diffusion layer thickness, 291 Digital storage oscilloscope, 307 Dimensional accuracy, 13, 168 Dipping, 34 Direct Current (DC), 41, 394 Discharge current, 98 Discharge energy, 96, 99, 130 Discharge gap, 11 Discharge loop, 155 Discharge phenomenon, 369 Displacement function, 163 Displacement sensitivity, 152 Disposable wire, 146 Disposal, 340 Dissipate, 77 Dissolution, 40 Dissolution-diffusion, 344 Dissolution machining, 43 3D microfeatures, 294 2D microstructures, 281 3D microstructures, 311, 327, 389 Downward defocus, 213 Dressing of micro-grinding tools, 43 Drilling, 3 Dross formation, 259 Dross free cut, 262 Dross inclusion, 240 Dry micro-EDM, 107 Duty cycle, 103 Duty factor (t), 100, 136 Duty ratio, 111 Dynamic polishing, 48 E EDM wire, 7 E-glass fibre composite, 402 E-glass fibre epoxy composite, 384, 403 Electrical and thermal conductivity, 101 Electrical circuits, 153 Electrical conductivity, 148 Electrical discharge grinding, 146 Electrical double layer, 286 Electrical potential gradient, 291 Electrical pulse, 96 Electrical Spark Discharge (ESD), 368 Electric Discharge Machining (EDM), 66, 94 Electric motors, 7 Electrochemical cell, 282, 290 Electrochemical Discharge Machining (ECDM), 14, 41 Electrochemical Grinding (ECG), 14, 40 Electrochemical Machining (ECM), 3, 276 Electrochemical Micromachining (EMM), 13, 38, 280 Electrochemical reaction, 290 Electrochemical Slurry Jet Machining (ESJM), 43 Electrode-electrolyte combination, 304 Electro deposition, 276 Electrodes, 94 Electro Discharge Machining (EDM), 3 Electrodynamic, 149 Electrolysis corrosion, 149 Electrolyte, 277, 299 Electrolyte circulation, 315 Electrolyte circulation system, 299 Electrolyte concentration, 42, 302, 385 Electrolyte flow, 303 Electrolyte properties, 301 Electrolyte temperature, 296 Electromagnetic actuators, 21 Electromagnetic brake gear, 170 Electromechanical systems, 88 Electron Beam Machining (EBM), 3, 4 Electron–phonon interaction, 256 Electrostatic, 28, 149 Electrostatic induction feeding, 177 Elevated elastic modulus, 181 Erbium (Eb3+), 229 Erosion, 9, 43 Erosion effect, 146 Erosion front, 182 Erosion mechanism, 161 Etchant, 34 Ethylene glycol and sodium bromide, 348 Excellent corrosion, 111 Excessive burrs, 322 Exothermic reaction, 260 Explosive pressure, 147 Extraction electrode, 28 Extrusion pressure, 47 F Fabricate 3D micro tools, 15 Fabricating, 13 Fabricating precise, 27 Fabrication, 2, 88, 94 Fabrication of micro features, 341 Fabrication of micro-grooves, 388 Index 415Fabrication of micropatterns, 355 Faraday’s law, 350 Faraday’s law of electrolysis, 282 Feedback control, 152 Feeding mechanism, 383 Feeding spool, 146 Feed rate, 299 Femtosecond ablation, 234 Femtosecond pulses, 248 Ferromagnetic, 11 FIB, 12 Fiber laser, 227 Ficrobiological Induced Corrosion (MIC), 341 Field-assisted, 50 Filter, 117, 126 Fine-grained Ni, 30 Finishing processes, 50 Fish-bone diagram, 98 Flash point, 101 f-h lens, 238 Flexibility, 13 Flow rate of slurry, 16 Fluoropolymers, 26 Flushing pressure (Pr), 104, 111, 112, 136, 150 Focus spot size, 233 Fragile materials, 65 Fundamental mode, 249 G Gallium, 10, 28 Gap voltage, 98, 102 Gas bubbles, 316 Gas turbine impeller, 6 Gaussian beam, 263 Gaussian energy distribution, 188 Gaussian mode (TEM00), 189 Geometric accuracy, 17 Geometrical features, 111 Glass-based micro-fluidic systems, 375 Glass substrates, 389 Gouy-Chapman layer, 287 Gravity-feed, 387 Grinding, 14 Grooves, 14 H Hall current sensor, 303 Hammering, 74 Hard coated plastic, 235 Hardest abrasive, 79 Hard-to-cut materials, 180 Harmonic wavelength, 234 Hastelloy, 41 Heat Affected Zone (HAZ), 12, 14, 257 Heat effected zone, 26 Heat energy, 136 Heating and melting, 183 Height of micro-peaks, 211 Helix angle, 112 H2 gas bubbles, 394 High aspect ratio, 110, 146, 183, 329 High aspect ratio holes, 12 High discharge voltage, 103 High-energy electrons, 4 Higher refractive index, 228 High focusability, 254 High precision, 94 High-precision ultrafine machining, 276 High Reflector (HR), 231 High-speed impact printers, 322 High-strength alloys, 277 High Strength and Temperature Resistive (HSTR), 149 Horn, 78 Horn and tool assembly, 64 Hot spot, 344 Hybrid micromachining technique, 44 Hybrid technology, 374 Hydraulic, 149 Hydraulic accumulator, 9 Hydrocarbon oils, 149 Hydrodynamic transport, 291 Hydrogen bubbles, 41, 396 Hydrogen film, 386 Hysteresis loss, 77 I IC fabrication, 33 IC-patterns, 27 Ignition delay period, 151 Ignition delay time, 159 Implantation, 28, 29 Improper flushing, 309 Inconel, 41 Inconel 625 superalloy, 272 Indentation, 75 Indenter geometry, 73 Industrial applications, 111 Industrial chemicals, 111 Infrared Region (IR), 234 Inject nozzle, 22 Inorganic glasses, 63 Inorganic salt, 344 In situ fabrication, 21 Instantaneous current, 155 Integrated Circuit (IC), 13 Integrated circuit boards, 45 Integrity, 87 416 IndexIntensifiers, 9 Inter Electrode Gap (IEG), 37, 96, 99, 278, 282, 296, 304, 339 Internal cylindrical surfaces, 11 Ion Beam Machining (IBM), 3, 27 Irregular micro-peaks, 211 Irregular topographies, 49 Ishikawa diagram, 295 Iso-frequency, 160 Isolation transformer, 236 J Jet-ECM, 14 Jet-EMM, 324 K Kerf width, 164, 270 Kerosene, 94 Kerosene dielectric, 116 Kinetic energy, 30, 82 L Lack-of-fit test, 268 Lamp current, 270 Laser Beam Machining (LBM), 3, 4, 62 Laser energy, 12 Laser fusion cutting, 259 Laser irradiance, 257 Laser irradiated zone, 206 Laser irradiation, 180 Laser micro-turning, 180 Laser peak fluence, 241 Laser polarization, 25 Laser scan passes, 211 Lateral cracks, 71 Letter H blind, 113 LIGA process, 281 Limiting current density, 291 Lithography, 27, 28 Localization of dissolution, 362 Localized current density, 346 Localized deformation, 71 Localized joule heating, 150 Localized temperature, 95 Lost wax method, 6 Low-frequency tool vibration, 315 Lubrication film, 48 M Machine controller unit, 307 Machine spindle, 68 Machining accuracy, 309, 316 Machining efficiency, 101, 134 Machining zone, 49, 82, 115, 131, 146 Magnetostrictively, 63 Magnetostrive, 77 Manufacture, 94 Manufacturer engineers, 117 Marking process, 247 Maskants, 34 Maskless EMM, 294 Mass transfer, 291, 299 Mass transport, 329 Material evaporation, 198 Material removal, 48 Material Removal Rate (MRR), 3, 65, 99, 240 Mechanical failure, 173 Median crack, 72 Medical fields, 5 Melt film, 259 Melt pool, 270 Metal Anisotropic Reactive Ion etching with Oxidation (MARIO), 360 Metal hydroxides, 284 Metallic salt, 34 Metallurgical damage, 40 Metallurgical property, 32 Metal oxide semiconductor field effect transistor, 151 Methanol sulfuric acid, 348 Mettler Toledo, 119 Microcantilever, 326 Microchannel, 43, 228, 318 Microcontact, 327 Microdimple, 323 Microdrilling process, 182 Micro-ECDM process, 367 Micro-ECM (lECM), 6, 62 Micro-EDG, 108, 109 Microelectrodes, 185 Micro-Electro-Mechanical-Systems (MEMS), 5, 10, 43 Microelectrical Discharge Machining (µ-EDM), 6, 10, 94, 107, 118 Microelectrochemical discharge machining, 43 Microfabrication, 146 Microfeature, 2, 12, 43, 66, 180 Microfixtures, 276 Microfluidic channels, 243 Microfluidics, 17 Microfuel cells, 5 Microgear, 39 Microgear dies, 176 Micrographs, 140 Microgroove, 5, 45, 184 Microhemisphere, 319 Microhole, 5, 119 Microhole generation, 141 Index 417Microhole geometry, 105 Microhole walls, 105 Microjoule, 248 Micromachining, 8, 40 Micromachining process, 94 Micro-meso machining, 7 Micrometal parts, 327 Micromilling, 281 Micronozzles, 317 Micron sized peaks, 210 Microparts, 62 Micropeaks, 208, 211, 223 Micropins, 320 Microproducts, 5, 111 Microreactor, 39, 278 Microregime, 4 Microscope (SEM) micrographs, 117 Microsensors, 5 Microshapes, 7 Microslice width, 399 Microslots, 5, 14, 309 Microsmooth surfaces, 322 Microspark, 11 Microstructure, 141 Microstructured glass, 88 Microsurgery, 5 Microtexturing, 26 Microthree-dimensional complex features, 6 Microtool, 10, 16, 22, 96, 297 Microtool fabrication, 280 Microtool feeding movement, 310 Microtool geometry, 109 Microtool insulation, 299 Microtool material, 298 Microtool movement, 309 Microtool vibration, 308, 354 Microtungsten wire, 330 Microturning, 186 Microturning depth deviation, 194 Microvalves, 5 Micro WEDM, 146 Microwire, 170 Microwire EDM, 105 Microwire electrode, 328 Millijoule, 248 Miniaturization, 21, 94 Miniaturization technologies, 5 Miniaturized, 51, 62 Minimizing machining time, 17 Mobility, 302 Modulation frequency, 246 Molybdenum wire, 149 Monochromaticity, 254 MRUM, 67 Multi-channel discharges, 174 Multilevel microstructure, 326 Multi objective optimization, 202 Multipass cuts, 152 Multipass micro-turning, 190 Multiple reflections, 259 Multipoint cutting tool, 10 N NaBr electrolytes, 357 Nanocomposte materials, 257 Nanofabrication, 325 Nanosecond, 232 Nanosecond pulses, 327 Narrow IEG, 304 Nd:YAG laser, 180 Near Infrared (NIR), 263 Neodymium (Nd3+), 229 Neurosurgical instruments, 22 Nickel alloys, 15 Non-conductive materials, 3, 10 Non-conducting medium, 147 Non-conventional machining, 3 Non-conventional technologies, 6 Non-linear effects, 231 Non-reactive gas, 258 Non-traditional machining, 62 Non-traditional processes, 2 Number of passes, 191 O Open circuit voltage, 158 Open pulses, 159 Optical micrographs, 134, 139 Optical microscope, 122 Optimum efficiency, 76 Opto-electro-mechanical, 181 Opto-electronics, 9 Orthogonal array, 404 Oscillating system, 76 Oscillator-amplifier system, 240 Outer Helmholtz Plane (OHP), 286 Overcut (OC), 113, 118, 121 Overload indicator, 76 Oxidation potential, 283 Oxide Film Laser Lithography, 45 Oxide layer, 40, 46 P Painless surgery, 320 Paraffin oil, 94 Parameter, 82 Parametric combination, 203 Passivating effect, 345 418 IndexPassivation, 300, 345 Passivation phenomenon, 346 Patterned photoresists, 357 Peak current (Ip), 111, 112, 121, 137 Performance criteria, 119, 193 pH, 283, 300 Phenanthrene, 29 Photochemical, 36 Photo-chemical process, 234 Photolithography, 360 Photon energy, 261 Photoreactive, 45 Photoresist, 34, 326, 355 Photoresist mask, 356 Photothermal ablation, 262 Physical phenomena, 254 Picosecond, 232 Piezoelectric, 15, 151 Piezoelectric effect, 77 Piezoelectric oscillators, 45 Piezoelectric Transducer (PZT), 38 Plasma, 98 Plasma channel, 95, 96 Plasma formation, 184 Plastically, 74 Plastics, 51 Pneumatic sensors, 45 Polarity, 100 Polarity techniques, 140 Polarization, 263 Polymethyl methacrylate (PMMA), 9, 244, 249 Polynomial regression model, 194 Porous anodization, 348 Positional accuracy, 20 Powder mixed dielectrics, 127 Precise disc shape, 320 Precise machining, 5 Precision, 20 Precision engineering, 111 Precision industries, 39 Precursor, 29 Preheated condition, 262 Pre-magnetizing, 77 Pressure flushing, 102 Pressure-regulating, 117 Print bands, 322 Process parameters, 83, 295 Prototyping, 26 Pulsating current, 297 Pulsating DC power, 4 Pulse burst, 248 Pulsed DC, 41, 381 Pulse direct current, 296 Pulsed laser, 24 Pulsed mode, 228 Pulsed Nd:YAG laser, 188 Pulsed Nd:YAG laser-based, 266 Pulse duration, 100, 103, 186, 297 Pulse energy, 147, 169 Pulse frequency, 100, 112, 320 Pulse generator, 98, 177, 307 Pulse interval, 159 Pulse-on-time, 111, 121, 169, 297 Pulse repetition rate, 186 Pulse width, 268 Pump energy, 230 Pure de-ionized, 117 Pure de-ionized water, 130 Pure kerosene, 117 Q Q-switching, 262 Q-switch mode, 180 Quartz, 15 R Random ionic migration, 160 R–C relaxation circuit, 155 Recast layer, 115, 184, 240 Reciprocating (to-and-fro) mechanism, 388 Recirculation pump, 63 Redeposition, 28 Reflective surfaces, 3 Regular pattern, 324 Re-ionization, 159 Relaxation circuit, 157 Reliability, 13, 38 Renewing electrolyte, 361 Repetitive and discrete spark, 146 Residual stresses, 65 Resistance capacitance, 19 Resistivity of electrolyte, 289 Resolidified material, 223 Response Surface Methodology (RSM), 112, 208 Reverse microtool, 311 Rhenium, 25 Rheological, 47 R-L-C circuit, 157 Rotary electrodes, 38 Rotatable Central Composite Design (RCCD), 194 Rotating electrodes, 132 Rotating micro-tool, 134 Index 419Rotating tool electrode, 134 Rotational effect, 133 Rotational speed of electrode, 112 Roundness error, 385 RUM, 65 S S/N ratio, 405 Scaling down, 4 Scanning Electron Microscope (SEM), 116, 219, 405 Schematic diagram, 50 Secondary acoustic horn, 78 Secondary sparking, 129 Second order, 234 Sensitiveness, 66 Sensitivity analysis, 244 Servo feed control system, 101 Servo feed mechanism, 97 Shank height, 320 Sharp cutting tools, 3 Sharp edges, 41 Shielding effect, 257 Short circuit, 304 Short duration impulses, 153 Short wavelength, 263 Sidewall insulated microtool, 327 Sidewall insulation, 313 Silicon carbide, 79 Simulated emission, 253 Single blind hole, 113 Sintered Diamond (SD), 81 Sludge and gas bubbles, 354 Sludge and precipitates, 381 Sludge formation, 317 Sodium nitrite (NaNO2), 348 Solid-state EMM, 325 Space shuttle, 342 Spark, 148 Spark Assisted Chemical Engraving (SACE), 43, 368 Spark discharge time, 127 Spark gap, 19, 95, 148 Spark gap width, 403 Sparking, 109, 121, 136 Sparking phenomena, 309 Sparking points, 138 Spark radius, 20, 113 Spark resistance, 156 Spatial confinement, 330 Specific external load, 162 Specific heat, 101 Specific scavenger, 360 SPM, 30 Spot Overlap (SOp), 186 Spot overlapping, 242 Sprayed coatings, 247 Spring feeding mechanisms, 373 Sputtering, 29 Square holes, 10 Stabilized zirconium oxide, 181 Stagnant electrolyte, 290, 316, 380 Static deflection, 165 Static load, 83 Static pressure, 78 Step down transformer, 401 Stepper motor, 21 Stochastic behaviour, 150 Strain hardening, 17 Stress corrosion, 111 Striation, 261, 265 Structural ceramics, 181 SU-8, 358 Subsurface cracking, 12 Subsurface damages, 75 Successive laser scanning, 207 Super alloy, 6 Surface energy, 28 Surface finish, 3, 11, 99, 180 Surface oxide film, 346 Surface plot, 201 Surface quality, 175 Surface roughness (Rt), 11, 113, 217 Surface structuring, 324 Surface texture, 403 Surface topography, 117 Surgical equipments, 44 Synchrotron radiation optics, 49 T Taguchi method, 402 Take-up spool, 146 Tantalum cathode filament, 31 Taper cutting, 105 Tapered, 32, 33 Temperature, 13 Temperature of electrolyte, 302 Temperature variation, 49 Thermal barrier coated super alloy, 241 Thermal conductivity, 101, 125 Thermal damage, 87 Thermal diffusivity, 256 Thermal effects, 38 Thermal energy density, 133 Thermal failure, 151 Thermal load, 152 Thermal stress, 24, 36 Thermoelectric power, 125 420 IndexThermo-mechanical analysis, 171 Thermo-mechanical stress, 259 Thin-foil devices, 363 Threshold voltage, 102 Through-mask EMM, 292, 293 Ti6Al4V, 138, 243, 324 Tight-tolerance, 88 Time domain, 134 Tissue stabilizer, 10 Titanium, 15 Titanium and its alloys, 343 Titanium and their alloys, 325 Titanium dioxide, TiO2, 341 Titanium gains, 345 Titanium oxide, 120 Tolerance, 3 Tolerance limit, 35 Tool feed rate, 299 Tool holder, 17, 305 Tool-holding unit, 378 Tool material, 20 Tool movement strategy, 316 Tool-surface bonding, 387 Tool wear, 4, 146 Tool Wear Rate (TWR), 103, 118 Tool wear ratio, 99 Topography, 29 Toxic acidic base electrolytes, 362 Toxic and reactive electrolytes, 350 Traditional manufacturing techniques, 2 Transducer, 21, 77 Transistors, 26 Transverse speed, 44 Travelling Wire Electrochemical Discharge Machining (TW-ECDM), 368, 393 Trepanning, 25 Trim cut, 153 Tungsten, 298 Tungsten carbide (WC), 19, 81, 298 Tungsten micro tool, 17 Tungsten tool, 83 Tungsten tool tip, 330 Two consecutive pulses, 206 Type of media, 10 U Ultra-precision, 7, 48 Ultra-short pulsed laser, 261 Ultrasonic Machining (USM), 3, 8, 15, 65 Ultrasonic micro machining, 81, 88 Ultrasonic vibration, 114 Ultrasonic wave, 16 Ultraviolet-patterned, 326 Uncharged gap width, 160 Uniform transpassive dissolution, 349 Unit Removal (UR), 5, 96 Upper wire guide, 105 Upward defocus conditions, 213 Upward defocusing position, 213 V Vacuum job fixture, 238 Vaporization, 24 Vaporization point, 258 Vapour-liquid interface, 256 Verification experiment, 203 Vibration amplitude, 164 Vibration frequency, 175 Viscosity, 101 Voltage and current waveforms, 156 Voltage gradient, 369 W Warburg Impedance (Rw), 288 Water Jet Cutting (WJC), 4 Water pressure, 44 Waveguides, 26 WC–Co, 22 Wear & tear, 254 Wear compensation, 108 Wear resistance, 108 Wedge-shape, 38 WEDM, 15 Weight per unit volume, 302 Wider crater formation, 200 Width of groove, 183 Wire electrode, 175 Wire electrode supply spool, 170 Wire Electro-Discharge Grinding (WEDG), 15, 66, 80, 379 Wire-electrolyte, 395 Wire feed, 151 Wire guides, 161 Wire lag, 169 Wire lagging, 165 Wire rupture, 150, 151 Wire tension, 165 Wire tension error, 171 Wire-tool vibration, 148 Wire transportation system, 170 Wire transport system, 171 Wire traveling, 329 Index 421Withstand pitting, 111 Work medium, 3 Workpiece, 109 Workpiece rotational speed, 191 Y Yb: YAG fiber laser, 246 Y feed rate, 199 Ytterbium (Yb3+), 229 Z Zirconate, 77 Zirconate Titanate, 18 422 Index
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