Admin مدير المنتدى
![مدير المنتدى مدير المنتدى](https://2img.net/i/itest/ranks/stars/stars13.gif)
![Admin](https://2img.net/u/1711/56/32/51/avatars/1-20.jpg)
عدد المساهمات : 18928 التقييم : 35294 تاريخ التسجيل : 01/07/2009 الدولة : مصر العمل : مدير منتدى هندسة الإنتاج والتصميم الميكانيكى
![كتاب Modern Machining Technology Empty](https://2img.net/i/fa/empty.gif) | موضوع: كتاب Modern Machining Technology الإثنين 13 يوليو 2020, 1:30 am | |
| ![](https://i.servimg.com/u/f61/15/36/74/14/subscr10.gif)
أخوانى فى الله أحضرت لكم كتاب Modern Machining Technology Advanced, Hybrid, Micro Machining and Super Finishing Technology Bijoy Bhattacharyya , Biswanath Doloi
![كتاب Modern Machining Technology M_m_t_10](https://i.servimg.com/u/f61/15/36/74/14/m_m_t_10.jpg) و المحتوى كما يلي :
Index Note: Page numbers followed by f indicate figures and t indicate tables. A Abrasion action, 38 Abrasive assisted advanced machining, 540 abrasive water jet machining, 540–552 electrical discharge machining, 552–556 electrochemical machining, 556–558 Abrasive feeding system, 87, 101–103 Abrasive flow finishing (AFF) advantages, 686 applications gears, 688 micro-bores, 688 micro-channels, 688 nozzles, 688 basic working principle, 679–680 challenges, 686–687 disadvantages, 686 finishing solutions, high-tech industries, 678 fixtures, 682 low material removal rate, 678 machine, 684f, 742 material removal process, 678 media, 682 process parameters abrasive media flow rate, 684 abrasive media viscosity, 685 abrasive particle size and concentration, 685 extrusion pressure, 683 number of cycles, 685 Abrasive fluidized bed (AFB) machining, 101–104, 104f Abrasive grain diameter rotary ultrasonic machining, 63–66, 65f stationary ultrasonic machining circularity error of larger diameter, 59–60, 59f circularity error of smaller hole diameter, 60f material removal rate, 52–53, 53f overcut of larger diameter, 55–57, 56f overcut of smaller diameter, 55–57, 56f Abrasive impregnated tool, 50–51 Abrasive jet machining (AJM), 10, 79, 86f, 511, 597 abrasive feeder, 87 abrasive types for, 88–90 advantages of, 95 applications of, 96 cryogenic, 99, 101f dimple appearance during, 97–98, 97f fluidized bed, 101–104, 104f fundamentals, 80, 80f gas propulsion system, 86–87 helical micro-channels, 98, 99f kinetic energy of single abrasive particle, 82 limitations of, 95–96 machining chamber, 87 material removal mechanism, 80–86, 81f micro-abrasive jet machining, 101, 102f mixing chamber, 87 nozzle, 87–88, 89f process parameters, material removal rate, 90–91, 91f abrasive flow rate, 91–92, 91f, 93f constant mixing ratio, 92, 93f grain size, 91–92, 91f, 93f mixing ratio on, 91–92, 92f nozzle pressure, 92, 93f stand-off distance on width of cut, 93–95, 94f variation of abrasives and ceramic workpiece, 97–98, 98f spring mask and helical channel, 98, 100f types and sizes of abrasive particle, 88–90 vertical set-up, 90f Abrasive parameters, 545 745Abrasive slurry concentration circularity error of larger diameter, 60, 61f material removal rate, 53, 54f overcut of larger diameter, 57, 57f Abrasive slurry supply unit, 46–47 Abrasive water jet machining (AWJM), 511, 540–552 advantages of, 550–551 application of, 551–552 catcher, 544 cutting head, 543 high pressure water generation system, 543 limitations of, 551 material removal mechanisms of, 541–542, 542t motion control unit, 544 process parametric studies on machining performance, 545–550 setup, 543–545 workpiece holding table, 544 Accuracy, electrolyte, 418–419 Acid electrolyte, 430–431, 442 Acoustic emission (AE) sensor, 120 Acousto-optic Q switch, 285–286, 285f Activation overpotential, 394 Additive processing technique, 694 Advanced engineering materials, 3 Advanced finishing process, 6, 676–677, 688, 716, 722 Advanced machining processes, 3–7, 10 Advanced manufacturing technology (AMT), 483–484 Aerial density, 702–704 Air injection, 374 Air plasma cutting technology, 244–245 Air plasma torch, 250, 251f Alternating current (AC), 170–171 Alumina, 260–262, 301 laser drilled hole on, 294, 295f laser mark of logo on, 322, 324f Aluminum (Al), 693–694 Aluminum alloy, 185, 260–261, 300–301, 357–358 Aluminum interconnects, 705 Aluminum oxide. See Alumina Aluminum titanate, 308 Ammonium persulfate, 376–377 Anions, 386 Anisotropic etching technique, 355 Anode, 386 dissolution, 417, 427 reaction at, 388, 514–516 Arc discharge, 489 Armor etching process, 374–375 Assisted flushing, 181–185, 184f Atomic scale processing, 128 Automated plasma cutting, 259–260 Automatic wire threader (AWT), 205 Automation of data exchanges, 5 Auxiliary electrode unit, 523 Axisymmetric sinusoidal wave channels, 152 B Barreling effect, 218 Beam current, 145 Beam overlap, 146 Beam parameters, 142–146 Benzotriazole (BTA), 705 Bernoulli’s Principle, 679 Biological tools, focused ion beam technique, 152 Bio-resorbable polymer, 631–632, 632f Blasting erosion arc machining (BEAM), 510 Boron carbide (B4C), 46, 47t, 71 Boundary element method (BEM), 424 Brittleness, 185, 324–325 Bruggeman’s equation, 402–403 Bubble generation, 401–404 C Capillary drilling (CD), 430 Carbon dioxide (CO2) laser, 274–275, 275f Carbon fiber reinforced plastic (CFRP) composite materials, 66, 69, 77, 303 Carbonyl iron (CI), 726 Carbonyl iron particles (CIPs), 725–726 Catcher, water jet machining, 111 Cathode, 386 cartridge, 334–335 reaction at, 389, 513–514 746 IndexCathodic tool electrodes and sinusoidal vibration motion with, 501–502 rectangular pulsed supply voltage and vibration with, 499–500 Cation, 386–387 Cavitation, 419 Cavity mirror, 273–275, 283–285 Cell wall cutting tool (CWCT), 152–153 Chemical blanking process, 374 Chemical etching process, 690–691 Chemical interaction, 466 Chemical machining (CM), 10–11, 11t, 367–368, 466 advancement in, 382–383 advantages and limitations of, 379–380 applications of, 380–381 chemical blanking, 374 chemical milling, 374–378 coating with masking material, 370 environmental issues, 383 etching, 370 job preparation, 369 laser assisted, 577–578 material removal by, 369f photochemical machining, 378–379 process parameters of, 371–373 scribing of the mask, 370 setup, 370f working principle, 368–370 Chemical mechanical planarization (CMP), 690, 694 Chemical mechanical plasma polishing (CMPP), 739 Chemical mechanical polishing (CMP), 734 advantages, 701–702 applications, 705–707 basic principle of, 691–697 chemical etching, 690–691 defects of corrosion, 705 dishing, 702 erosion, 704, 704f scratching, 704 hybrid finishing process, 690–691 mechanical abrading, 690–691 metal, 690–691 planarization technique, 690 polysilicon, 690–691 process parameters, 699–700 semiconductor industry, 690–691 setup details, 697–699, 697f ultra-precision polishing, 690 Chemical micromachining (CMM), 601–602 Chemical milling, 367, 374–378, 376f Chemical vapor deposition (CVD), 693, 695–696 Chemo-mechanical and magnetorheological finishing, 706, 706f Chirped pulse amplification (CPA), 328 Chronological development, 1–3 CIM. See Computer integrated manufacturing (CIM) CIPs. See Carbonyl iron particles (CIPs) Circularity error of larger diameter (CELD), 59–60 abrasive grain diameter on, 59–60, 59f abrasive slurry concentration, 60, 61f power rating on, 60, 61f tool feed rate on, 62, 62f Circularity error of smaller hole diameter (CESD), 59–60, 60f Citric acid, 412–413 Cleaning masking material, 370 Closed loop control system, 406 Closed-loop wire tension control system, 223 CMP. See chemical mechanical planarization (CMP) Coated wire electrode, 219–221 Colliding water jets (CWJ), 121 Computer aided design (CAD) model, 74–75, 206, 208 Computer integrated manufacturing (CIM), 238–239 Computer numerical control (CNC) system, 2, 5, 136–137, 139, 714 abrasive jet machining, 87 electrical discharge machining system, 186 plasma arc cutting system, 260–261 water jet machining, 109–110, 118 Concentration overpotential, 394 Index 747Condenser, 135–136 Constant current (CC), 406 Constant mixing ratio, 92, 93f Constant voltage (CV), 406 Continuous wave (CW), 267–268, 274–275, 278 Control unit, stationary ultrasonic machining, 47–48 Conventional machining, 9–10, 12–15, 27, 163–164, 350–352, 462, 466 Conversion zone, 6 Coolant supply unit, 51–52 Copper, 382, 411 Copper interconnects, 706 Copper vapor deposition (CVD), 695–696 Copper vapor laser (CVL), 329, 329f Corner radius, 217 Cos? method, 420–422, 421f Coupler, stationary ultrasonic machining, 43 Crossed flow path, 408, 408f Crushed glass, 88–90 Cryogenic abrasive jet machining (CAJM), 99, 101f Cupric chloride, 376–377 Current density, 473 Current efficiency, 392, 416f Cutting force, 66–67, 67f Cutting operation, water jet machining, 117 Cutting parameters, 545 Cutting tools, focused ion beam technique, 151, 152f Cyclotron frequency, 132–133 D Damascene process, 694, 695f Data acquisition unit, 51 Deburring operation, 118 Decomposition potential, 395 Demasking, 377 Dental ceramics diamond grinding on, 75–76, 76f rotary ultrasonic machining on, 75–76, 76f De-oxidizing solutions, 375–376 Dew point meter (DPM), 736–737 Diamond grinding (DG), 26, 75–76, 76f Dielectrics, 180–184 constant, 707 fluid, 168–169, 180–181, 618 flushing, 181–184 assisted, 184, 184f emersion, 184 jet, 183, 184f pressure, 183, 183f suction, 182, 183f flushing of, 181–185 gaseous based, 181 hydrocarbon oil based, 181 physical properties, 181, 182t supply unit, 205–206 types, 181 water based, 181 Die sinking electrical discharge machining machine, 170, 172f Die-sinking micro-electro discharge machining, 614 Diode laser, 277–279, 278–279f Dip-masking process, 376–377 Direct current (DC), 170–171, 274–275 Direct injection (DI), 688 Direct numerical control (DNC), 2 Direct writing technique, 624–625 Discharge energy, 195–196 Discharge reaction force, 214–215 DPM. See dew point meter (DPM) Drilling operation, water jet machining, 118 Dual damascene process, 694–695, 696f Dual gas plasma torch, 251 Dummy fill method, 702–704, 703f Duoplasmatron ion beam sources, 133–134, 133f Dwell time, 146 Dynamometer, 51 E Eccentric cam mechanism, 719–720 Elastic emission machining (EEM) advanced optics fields, 709 advantages, 714 applications, 714 basic working principle, 709–710 mirror finish surface, 709 748 Indexnon-contact ultra-precision machining process, 709 process parameters, 712–713 setup details, 711–712, 712–713f ultra-fine powders, 709 Electrical circuitry, 523, 525–526, 525f Electrical conductivity, 181–185, 220–221, 287 Electrical discharge grinding (EDG), 229 Electrical discharge machining (EDM), 11, 27 abrasive assisted, 552–556 advancement in, 238–241 advantages, 234–235 alloying and coating with, 239–240 applications, 237–238 basic scheme of, 166, 166f carbon nanofiber-assisted micro, 555f conventional, 555f die sinking machine, 170, 172f discharge current waveform vs. machining characteristics, 197–198, 198f discharge spot, 168, 168f dry, 239 energy distribution, 169, 169f environmental impacts of, 235–237 equipment, 170–187 control system, 177–180, 177f dielectric system, 180–184 gap voltage and current waves, 171–174, 173f power supply, 170–176 resistance-capacitance relaxation circuit, 171–174, 173f rotary impulse circuit, 174, 174f sub units, 170, 171f tool electrode, 185–187 transistor type controlled pulse circuit, 174, 175f feedback loops for adaptive control in, 177–178, 177f gap phenomena in, 167, 167f generalized approaches for, 193–195, 194f hazard potentials of, 235–236, 236f laser assisted, 576–577 limitations, 235 machining accuracy, 199–203 material removal, 167–169 for pulse generator circuit, 192–193 at single discharge, 188–189 and surface finish for RC circuit, 189–191 vs. micro electro discharge machining, 614–618, 615t in modern manufacturing industry, 484 nonconducting materials, machining of, 240–241 overcut, 200–201, 201f parameters on machining characteristics, 195–199 peak current on material removal rate, 195–196, 196f on relative wear ratio, 196, 196f on surface roughness, 197, 197f polarity, influence of, 199 power supply and control system, 238–239 surface finish, 191–192 surface integrity, 201–203 taper, 200, 200f thermal interaction, 464–466 tool design and fabrication, 239 types, 170, 170f vibration assisted, 560–564 voltage and current waveforms, 179, 179f wire electrical discharge machining, 203–229 Electrical discharge phenomena, 516–518, 519f Electrical power supply system, 525 Electric discharge grinding (EDG), 15–16 Electrochemical arc machining (ECAM), 483–484 advancements in, 510–511 advantages and limitations, 509 amplitude of tool oscillation, 492 applications, 509–510 electrochemical dissolution process in, 486, 487f electro-discharge erosion in, 488 material removal rate in, 494f, 495–502 parameters on machining characteristics, 502–508 process capabilities of, 509 Index 749Electrochemical arc machining (ECAM) (Continued) process variants of, 510f scheme of, 490f set-up details, 489–495 working principle of, 484–489 Electrochemical deburring, 433–434, 433f Electrochemical deposition (ECD), 693 Electrochemical discharge grinding (ECDG), 539 Electrochemical discharge machining (ECDM), 15–16, 511–512 advancements in, 538–540 advantages and limitations, 537–538 applications, 538, 538f auxiliary electrode unit, 523 electrical discharge phenomena in, 516–518 electrochemical reaction mechanism in, 513 electrolyte supply system, 524 electrolytic cell of, 514f input output model of, 520f inter electrode gap control unit, 524 job holding and feeding unit, 522 machining chamber, 521 material removal rate in, 526–528 overcut and machining depth criteria in, 531–536 parameters on machining characteristics, 528–531 process capabilities of, 536–537 reaction at anode, 514–516 reaction at cathode, 513–514 set-up details, 521–526, 521f thermal spalling phenomena in, 518 tool holding and feeding unit, 522 tool wear in, 519–520 triplex hybrid methods, 537f, 539 working principle of, 512–520 Electrochemical discharge turning (ECDT), 538–539 Electrochemical dissolution (ECD) amplitude of tool vibration on, 504–505, 505f, 507f in electrochemical arc machining, 486, 487f equivalent circuit of, 525–526, 525f machining voltage on, 504, 504f material removal mechanism of, 471–472, 487f partitioning effects of, 501–502 working principle of, 484–486 Electrochemical drilling, 427–432, 429f Electrochemical grinding (ECG), 15–16, 447–448, 447f, 467, 483 advancements in, 481–483 advantages and limitations, 480–481 applications of, 481 brazed diamond wheel in, 483 material removal rate in, 468f, 469, 476–478 for micro-hole grinding, 482f process capabilities of, 479–480 set-up details, 469–471, 470f working principle of, 468–469 Electrochemical honing, 448–449, 448f Electro-chemical interaction, 466 Electrochemical machining (ECM), 10–11, 11t, 27, 385–386, 466–467 abrasive assisted, 556–558, 557f accuracy, 418–419 advancement in, 453–456 advantages and limitations of, 452 applications of, 453 control of end gap, 454 different variants of, 427–450 drilling techniques, 432t electrolysis, principles of, 386–387 environmental impacts of, 450–452 equipment details, 404–407 fundamental principle of, 486–487 hazardous wastes, 451f heat and bubble generation effects, 401–404 hybridization, 456 kinematics and dynamics of, 395–401 laser assisted, 577–578 on machining performances, 413–417 micro, 455 model development, 454 numerical control, 455 power supply, 491 process characteristic of, 414f 750 Indexwith pulsed power supply, 454 setup with different sub units, 404–405, 404f surface integrity, 417–418 tool design, 419–427, 454 tool material, 411–413 vibration assisted, 564–567, 565f wire, 456, 639–640, 645f working principle, 387–395 Electrochemical micromachining (EMM), 601–602, 632–633 advantages and challenges, 643–644 applications, 644–646 basic mechanism, 633–635 classification of, 637f electrochemical machining vs., 641, 642t high-aspect-ratio microcolumn, 646f influence of process parameters, 641–643 jet, 638 maskless, 638 microdrilling, 638 and micro-electro discharge machining milling in sequence, 661 micro hemisphere fabricated by, 644–646, 645f microtool feed rate, 643 micro tools, 640–641 sequential machining of, 662f setup details, 635–641 stages of, 651f 3D, 639 through mask, 636–637 types of, 636 Electrochemical milling, 434–439, 436f advantages of, 438 challenges of, 439 Electrochemical penetration, 473 Electrochemical sawing, 446–447, 446f Electrochemical turning, 449–450, 450f Electrode potential, 394 Electro-discharge erosion (EDE), 484–486 in electrochemical arc machining, 488 feed rate on, 506, 506f machining voltage on, 508f material removal due to, 507 partitioning effects of, 501–502 pronounced effect on, 506–507 Electro discharge grinding (EDG), 229 conventional, 232, 233f milling by, 233, 233f modified, 232, 233f process mechanism, 230–231, 230f process parameters, influence of, 234 setup, 231–232, 231f types, 232–233, 233f Electro discharge milling, 233 Electro discharge phenomenon, 170 Electrolysis, principles of, 386–387, 386f Electrolyte for different metals machining, 413t in electrochemical arc machining, 491 flow paths and insulation, 407–411, 409f flow rate, 417f, 469–471 flow system, 405, 491 flow velocity, 401, 402f, 415–416, 418 influence on current efficiency, 416f resistance, 473 splashing, 451–452 supply system, 524 tool material and, 411–413 Electrolyte-gas medium, 402–403 Electromigration, 693–694 Electron beam machining (EBM), 5, 11, 106–107, 126, 464–466, 511 advancements in, 356–359 advantages, 350–352 applications, 351t, 353–356 characteristics, 127t colliding phenomena of incident electrons, 336–337, 337f drilling, 353 electron beam generation, 333–336 electron gun, 334–335, 334–335f integrated circuit fabrication, 355–356, 356f limitations, 352 material removal mechanism in, 336–338 multi pulse drilling, 348 perforation mechanism, 337–338, 338f perforation of thin shit, 353–354, 354f power requirements for metals, 347, 347f non-metals, 347, 348f Index 751Electron beam machining (EBM) (Continued) process parameters, influence of, 345–350, 347–349f rapid prototyping process, 357–358, 357f setup, 338–340, 339f slotting, 354 theoretical consideration aberrations on maximum current density, 342–343 current density, 341–342 material removal, 343–345 Electron beam melting process, 358–359 Electron beam perforation, 354f Electron beam technique, 355–356 Electron cyclotron resonance (ECR), 132–133, 133f Electron gun configuration, 334–335, 334f normal triode system, 335, 335f parameters of, 340 pierce gun configuration, 335, 335f Steigerwald gun configuration, 335, 335f Electro-pneumatic control unit, 41f, 48 Electropolishing (EP), 466 Electrostatic deposition, 376–377 Electrostatic lens, 137, 139 Electrostream drilling (ESD), 431 Emersion flushing, 181–185 Energy balance equation, 281 Energy distribution, in electrical discharge machining, 169, 169f Energy pump, 270 Equilibrium gap, 398 Erosion rate, abrasive jet machining, 85–86 Etchants, 371, 374–375, 377 Etched mobile telephone gasket, 380, 382f Etched suspension head assemblies, 380, 381f Etch factor, 368, 368f Etching operation, 370 Ethylenediaminetetraacitic acid disodium salt (EDTA-Na2), 412–413 Excimer laser, 267–268, 275–277, 276–277f, 277t, 299, 322 Extreme ultraviolet (EUV), 709, 714 F Faraday’s law, 387, 392, 437 Fast Fourier Transform (FFT), 264 Feed rate of electrode, 493 Femtosecond laser system, 298–299, 629 Ferric chloride, 371, 376–377, 382–383 Fiber Bragg grating, 283–284 Fiber laser, 273, 274t, 289f Fiber optics, 273, 283–284 Filter regulator lubricating (FRL) unit, 86–87 Finite element method (FEM), 423–427 Flexible magnetic abrasive brass (FMAB), 716 Flow velocity of electrolyte, 401, 402f through gap, 403 Fluidized bed assisted abrasive jet machining (FB-AJM), 101–104 FMAB. See flexible magnetic abrasive brass (FMAB) Focused ion beam (FIB), 123, 125, 134, 140, 156, 156f advantages, 150–151 applications of, 126f, 151–153 controlling factors and parameters, 142f fabrication of silicon island arrays, 155 functions of, 124 gas cluster ion beam, 137–140, 138–139f limitations, 151 liquid metal ion sources, 134–135, 134f material removal, 141 non planar surface, 152 operation, 141f scan strategy, 147–150, 148f with SEMZEISS Crossbeam 340, 140f simulation software, 150 single vs. multiple pass, 149 system setup, 135–137, 136f “V” shaped milled profile, 149, 149f Free electron, 333–334 Fuel injection nozzles, 6–7 Fuzzy neural network, 263 752 IndexG Gallium nitride (GaN), 735, 739 Gas bubble, 168–169, 193, 198–199, 214–215, 224–225 Gas cluster ion beam (GCIB), 123–124, 137–138 characteristics, 138f setup, 139–140, 139f Gas filled ion sources (GFIS), 130–131 Gas injection, 147 Gas propulsion system, 86–87 Geomagic Studio12, 74–75 Glass beads, 88–90 Glass grinding, 657–658, 658f Global planarization technique, 701–702 Gray relational analysis, 258–259 H Hafnium alloyed electrode, 250 Hard disc drives (HDD), 706–707 Heat affected zone (HAZ), 6, 202, 235, 252, 292, 312, 324–325, 417 Heat energy, 526 Heat flux equation, 193 Heat generation, 401–404 Hemispherical cavity, ultrasonic machining developed tool and, 74–75, 76f on hydroxyapatite bio-ceramics, 72–74, 74f on workpiece, 72–74, 74f Hertzian contact stresses, 33–34 Hexagonal tool, 44–45, 44–45f High aspect ratio microchannels, 153 High energy fluid jet machining, 120 High frequency plasma type ion beam machining, 132, 132f High specific heat, 180–181 High speed machining test, 357 High-strength-temperature resistant (HSTR) alloys, 229, 237–238, 483–484 High tolerance plasma arc cutting (HTPAC), 260–262 Horn, stationary ultrasonic machining, 43 Hot-plasma ion source, 132–133 Hybrid machining process (HMP), 3 abrasive assisted advanced machining, 540–558 advancements in, 582–583 advantages and limitations of, 580–582 by combining different interactions, 465t electrochemical arc machining, 483–511 electrochemical discharge machining, 511–536 electrochemical grinding, 467–483 laser assisted advanced machining, 570–580 need and basis of classification of, 463–467 vibration assisted advanced machining, 558–570 Hybrid micromachining, 647 classification of, 464f micro-electrochemical machining and laser beam machining, 648–651 micro-electro discharge machining and micro electrochemical machining, 647–648 Hybrid modern machining processes, 15–16 Hydraulic mean diameter, 403 Hydraulic parameters, 545 Hydrocarbon oil, 181, 197, 199, 202–203, 240 Hydrochloric acid, 376–377 Hydrodynamic force, 215 Hydrofluoric acid, 376–377 Hydrogen gas bubbles, 419 Hydrogen peroxide, 376–377 Hydro-magnetically confined plasma arc, 261–262, 262f I Incident angle, 130 on sputtering yield, 144, 144f on surface roughness, 145f Inclination angle, 87–88 Infrared (IR), 267–268 Insulated gate bipolar transistors (IGBT), 454–455 Integrated circuits (ICs), 326–327, 377–378, 380, 381f, 595, 706–707 Intensifier, 109 Index 753Interelectrode gap (IEG), 468, 494f, 515, 530–531, 531f control unit, 524 dimension, 493 machined depth, 533–536, 534–536f on radial overcut, 533, 533f Interference technique, 625 Inter-layer dielectric (ILD), 701–702, 705–706 Inter-metal dielectric (IMD), 695–696 International business machines (IBM), 694 Ion beam machining (IBM), 5, 10, 123–124 advancement in, 153–156 advantages, 150–151 applications of, 151–153 characteristics, 127t Duoplasmatron sources, 133–134, 133f electron cyclotron resonance, 132–133, 133f focused (see Focused ion beam (FIB)) functions of, 124–126 high frequency plasma type, 132f ion shower type, 131–132 limitations, 151 material removal mechanism, 126–130, 128f process parameters, 141–142 beam parameters, 142–146 operation parameters, 146–147 simulation software, 150 types of, 130–134, 131f Ion dose, 144 Ion energy, on sputtering yield, 143, 143f Ion-fluence, 144 Ion-flux, 144 Ion shower type, ion beam machining (IBM), 131–132 Ion species, 142 Ion sputtering, 128–129, 129f Isobutylene-isoprene copolymers, 376–377 J Jet electrochemical machining, 578 Jet electrochemical micromachining, 638 Jet electrolytic drilling (JED), 429 Jet flushing, 181–185, 184f Job material, machinability factors, 4 Job shape complexity, 4, 4f Joule heating, 401, 442 K Kaufman ion shower type ion beam machining, 131–132, 131f Keller’s reagent, 376–377 Kerf width, 216, 217f, 305, 306f Krypton arc lamp, 271–272, 283–285 L Laplace’s equation, 423–425 Laser beam delivery and focusing unit, 286 cavity mirror, 285 cutting, 299–307, 302f, 304t drilling, 292–299, 294–295f gooving, 307–312, 308f head, 283 light emission, 268 marking, 317–323, 318f optical excitation unit, 284 population inversion, 270 Q-switch and RF drive unit, 204–205, 285f spontaneous emission, 268 stimulated emission, 268, 271f turning, 312–317, 314–317f Laser assisted advanced machining (LAAM), 570–580 Laser assisted ceramic machining, 574–575 Laser-assisted etching (LAE), 579–580 Laser assisted mechanical machining (LAMM), 570–575 Laser assisted milling, 572–574 Laser assisted oxygen flame cutting (LASOX), 326–327 Laser assisted turning, 571–572 Laser beam helical drilling, 292–294 Laser beam machining (LBM), 5, 11, 106–107, 464–466, 511 advancements of, 328–329 advantages, 324–326 applications, 326–327, 327t assist gas supply unit, 287–288 carbon dioxide laser generation, 274–275, 275f cavity mirror, 285 754 Indexcomputer numerical control controller for X-Y-Z axes movement, 288–289 cooling unit, 287 diode laser generation, 277–279, 278–279f excimer laser generation, 275–277, 276–277f, 277t fiber laser generation, 273, 274t, 289f hybridization, 648–651 laser beam delivery and focusing unit, 286 beam delivery unit, 283–287 cutting, 299–307, 302–304f, 304t drilling, 292–299, 294–295f generation, 283–287 grooving, 307–312, 308–310f head, 283 light emission, 268 marking, 317–323, 318f, 320–324f population inversion, 270 spontaneous emission, 268 stimulated emission, 268, 271f turning, 312–317 types, 267–268, 269t limitations, 324–326 material removal mechanism in, 279–281, 280–281f vs. micro laser beam machining, 626–627, 628t Nd:YAG laser, 271–272, 272t, 272f optical excitation unit, 284 process parametric studies, 289–323 air pressure, 292 focal spot size, 291, 291f peak power, 290 pulse duration, 290 pulse frequency, 290 scanning speed, 290 Q-switch and RF drive unit, 285, 285f vibration assisted, 567–570, 569f Laser hole drilling, 292–294, 294f Laser micro ablation plus micro-electrical discharge machining, 659 Layer-by-layer method, 435–436, 436f Light amplification by stimulated emission of radiation (LASER), 266 Light emitting diode (LED), 706–707, 739 Liquid interface, 336–337 Liquid maskant, 376–377 Liquid metal ion sources (LMIS), 130, 134–135, 134f Longitudinal waves, 24–25 M Machinability factors, of job material, 4 Machine control unit, 406 Machining chamber, 87, 521 classification, 5 economy, 9–10 parameters, 12, 13t technology, 1–3, 2f Magnetic abrasive finishing (MAF) advantages, 721 applications, 721–722 basic working principle, 716–718, 717–718f ferromagnetic abrasive particles, 716 flexible magnetic abrasive brass, 716 process parameters, 720–721 setup details, 718–720, 720f Magnetic abrasive flexible brush (MAFB), 716–718 Magnetic field assisted finishing (MFAF), 732–733 Magneto plasma dynamic thruster (MPDT), 263 Magnetoreological abrasive honing (MRAH), 732–733 Magnetorheological abrasive flow finishing (MRAFF), 726–728, 727f Magnetorheological finishing (MRF) advantages, 731–732 applications, 732–733 basic principle, 724–726, 725f challenges, 731–732 magneto-rheological abrasive flow finishing, 724 magnetorheological fluid, 724–726, 726–727f material removal rate and surface roughness abrasive particle concentration effect, 730, 731f carrier wheel speed effect, 730, 731f magnetic flux density effect, 729, 729f Index 755Magnetorheological finishing (MRF) (Continued) magnetic particle concentration effect, 729, 730f process parameters, 728–731 rotary magneto-rheological abrasive flow finishing, 724 setup details, 727–728 Magnetorheological (MR) fluid, 725–726 Magnetostrictive transducer, 42 Manipulators types, 151 Maskants, 371–373 Maskless electrochemical micromachining, 638 Mask projection technique, 625 Mass flow controller (MFC), 736–737 Mass ratio, 92 Mass transfer, 392 Material applications, 14t Material removal rate (MRR), 211–213, 279–281, 322, 336–338, 679, 685, 700, 728–729 abrasive jet machining, 80–86, 81f, 90–91, 91f abrasive flow rate, 91–92, 91f brittle materials, 83 constant mixing ratio, 92, 93f ductile materials, 84 grain size, 91–92, 91f, 93f mixing ratio, 91–92, 92f nozzle pressure, 92, 93f stand-off distance on width of cut, 93–95, 94f variation of abrasives and ceramic workpiece, 97–98, 98f amplitude of tool vibration on, 504–505, 505f, 507f development of, 499 due to electrochemical dissolution, 474 in electrochemical arc machining, 494f, 495–502 in electrochemical discharge machining, 526–528 in electrochemical grinding process, 474–475 in electron beam machining, 336–338 feed rate on, 506, 506f focused ion beam milling, 141 ion beam machining, 126–130, 128f laser beam machining, 279–281, 280–281f machining gap with feed rate, 477, 478f machining gap with set depth of cut, 477, 479f machining voltage on, 504, 504f, 508f mathematical modeling for, 471–472, 495 by mechanical grinding, 475 plasma arc machining, 245–246 process parametric influences on, 476–478 for pulse generator circuit, 192–193 rotary ultrasonic machining, 37–40, 38f, 63–66, 64–65f with set depth of cut, 477, 478f at single discharge in electrical discharge machining, 188–189 stationary ultrasonic machining, 28–37, 29f abrasive grain diameter, 52–53, 53f abrasive slurry concentration, 53, 54f power rating effect on, 53–55, 54f rotary ultrasonic machining, 37–40, 38f tool feed rate on, 55, 55f and surface finish for RC circuit, 189–191 variation with feed rate, 477, 477f variation with machining voltage, 476f water jet machining, 107–108 nozzle tip distance effect, 114, 115f transverse feed rate effect, 113, 114f water pressure effect, 113, 113f Mechanical action (MA), 480 Mechanical amplifier, 43 Mechanical assisted electrochemical grinding process. See Electrochemical grinding (ECG) Mechanical grinding process, 467 Mechanical interaction, 464 Mechanical micromachining, 597–599 Mechanical unit, 405 MEMS. See Microelectromechanical systems (MEMS) Metal hydroxide, 387–388 Metal inlay technique, 694 Metal matrix composites (MMC), 556–557 756 IndexMetal oxide semiconductor field effective transistor (MOSFET), 175, 454–455 MFAF. See Magnetic field assisted finishing (MFAF) Micro-abrasive jet machining (Micro-AJM) conventional and novel approach, 101, 102f set up, 101, 102f Micro-chipping, 33–34 Microdrilling, 638 Micro electrochemical machining, 455 Micro electrochemical machining hybridization, 647–651 Micro electro discharge machining (micro-EDM), 611–612 advancement and challenges, 619–621 applications, 616t, 621–622 basic mechanism, 612–613 drilling, 615 electro discharge machining vs., 614–618, 615t hybridization, 647–648 influences of process parameters, 618–619 laser micro ablation plus, 659 micro turning and, 657 milling, 615 plus electrochemical micromachining sequential machining process, 660 plus micro grinding, 657, 659f problematic areas in, 622f sequential machining of, 662f setup details, 613–614, 614f types of, 614–618 Microelectromechanical systems (MEMS), 377–378, 383, 706–707 Micro-groove cut on alumina by Nd:YAG laser, 308–309, 309f on aluminum titanate, 308, 308f on polymethyl methacrylate by fiber laser beam, 309–310, 310f on Ti-6Al-4V by fiber laser beam, 309–310, 310f Micro-hole, 181, 292–296, 329, 329f Micro laser beam machining (micro-LBM), 623–624 advantages and challenges, 630–631 applications, 631–632 basic mechanism, 624–626 influence of process parameters, 627–630 laser beam machining vs., 626–627, 628t setup details, 626 Micromachining, 18, 100, 199, 229, 233, 235, 237–238 chemical, 601–602 conditions for, 602–603 electrochemical, 601–602, 632–646 hybrid micromachining, 647–651 implementations, 594 mechanical, 597–599 micro electro discharge machining, 611–622 micro laser beam machining, 623–632 micro ultrasonic machining, 603–611 need and basic of classification, 595–602 non-traditional, 596–597, 596f sequential micromachining processes, 652–667 technology, 3, 6–7 thermal, 599–601 Microsparking, 617 Microsystems technology (MST), 383 Micro turning, and micro-electro discharge machining, 657 Micro ultrasonic machining (MUSM), 603 advancements and challenges, 609–610 applications, 610–611 basic mechanism, 603–605 influence of process parameters, 607–608 setup details, 605–606 ultrasonic machining vs., 606–607, 607t Micro wire electro discharge machining, 614 Mill module, upper portion of, 47–48, 47f Miniaturization requirements, 6 Mixed electrolytes, 412–413 Mixed flow path, 408, 409f Mixing chamber, 87 Mixing ratio (M), 91–92, 92f Modern machining methods, 1–2, 4, 6–7, 9–10 accuracy for, 15, 16f, 18 automation of data exchanges, 5 classifications, 10–11, 11t, 19f Index 757Modern machining methods (Continued) factors of, 7 hybrid (see Hybrid modern machining processes) material applications, 14t micro features (see Micromachining) parameters, 12, 13t process capability, 15, 15t process economy, 15, 17t selection scheme for, 12–18 shape complexity of job, 4, 4f suitability of, 12, 14t surface finish for, 15, 16f, 18 surface integrity, 6 Molybdenum wire, 219–220, 229 Monte-Carlo simulation, 150 Multichannel plate (MCP), 135–136 Multidiode ytterbium doped fiber laser, 273, 274f, 290f N Nano finishing process, 678 Nano lathe, 155–156, 156f Nano-net, 152–153, 154f Nano-rotors, 151–152, 153f Nd:YAG laser, 271–272, 272t, 272f, 282f, 312–313, 314f Neodymium ion, 283 Neoprene elastomers, 376–377 Nitric acid, 371, 376–377 Non-conventional machining processes, 462, 466 Nonpassivating electrolytes, 412 Nontraditional machining methods, 1–2 Non-transferred arc plasma arc machining system, 246–247 Nozzle abrasive jet machining, 87–88, 89f material removal rate, 92, 93f set up, 89f water jet machining, 109 Nozzle tip distance (NTD) abrasive jet machining, 87–88, 90 material removal rate, 114, 115f Numerical control (NC), 2 electrochemical machining, 455 O Objective lens, 135–136 Ohm’s law, 391, 472, 498 One-way abrasive flow finishing process, 679, 680f Operation parameter ion beam machining, 146–147 water jet machining, 117–118 Orbital abrasive flow finishing process, 680, 681f Overcut, 200–201, 201f Overcut of larger diameter (OLD) abrasive grain diameter, 55–57, 56f abrasive slurry concentration, 57, 57f power rating, 57–58, 58f tool feed rate, 58–59, 58f Overcut of smaller diameter (OSD), 55–57, 56f Overpotential, 394–395 Overvoltage, 394–395 Oxide film laser lithography (OFLL), 580 Oxidized dielectric oil, 181 P PAP. See Plasma assisted polishing (PAP) Passivating electrolytes, 412 Penetration velocity, 475 Percussion drilling technique, 292–294 Photochemical machining (PCM), 371–373, 375, 378–379 Photochemical milling process. See Photochemical machining (PCM) Photo etching. See Photochemical machining (PCM) Photolithography, 378 Photon generation principle, 270 Photoresist masking method. See Photochemical machining (PCM) Physical vapor deposition (PVD), 693 Piezoelectric transducer (PZT), 41, 634 Plasma, 244–245 Plasma arc cutting (PAC), 244–245 Plasma arc machining (PAM), 248f advancement in, 261–264 758 Indexadvantages, 259–260 applications, 260–261 historical development of, 244–245, 244f hydro-magnetically confined, 261–262, 262f limitations, 259–260 machining rate, 245–246 material removal, 245–246 non-transferred arc, 246–247, 247f plasma gas supply unit, 249 plasma torch, 249–251, 251f power supply unit, 248 process parameters, influence of, 252–259, 253–254t, 255–258f, 259t setup, 247–251, 264f shielding gas supply unit, 249 transferred arc, 246, 247f types, 246–247 water-shielded plasma torch, 251, 252f Plasma assisted polishing (PAP) advantages, 738–739 applications, 739–740 basic working principle, 734–737 chemical dry polishing method, 734 chemical mechanical polishing, 734 process parameters, 738 setup details, 737, 737f Plasma beam machining (PBM), 11, 464–466 Plasma source ion implantation (PSII), 123–124 Plasma torch, 249–251 Plastic deformation, 38–39, 107–108 Platinum, 430–431 Polarization curves, 393–394 Polycrystalline diamond (PCD) tool, 657–658 Polyurethane sphere, 709–712 Potassium carbonate, 469–471 Powder metallurgy (PM), 187 Powder mixed electrical discharge machining (PMEDM), 552–556, 553f Power rating, stationary ultrasonic machining circularity error of larger diameter, 60, 61f material removal rate, 53–55, 54f overcut of larger diameter, 57–58, 58f Power supply unit, 406, 491 rotary ultrasonic machining, 50–51 stationary ultrasonic machining, 48–49 Precision machining operations, 2 requirements, 5 Pre-metal dielectric (PMD), 695–696 Pressure flushing, 183, 183f Preston’s equation, 700 Printed circuit board (PCB), 118, 377–378, 706–707 Process capability, 15, 15t Process economy, machining processes, 15, 17t Pulsating water jet (PWJ), 120 Pulsed wave (PW), 267–268, 274–275, 525f Pulse electrochemical machining (PECM), 454, 466 Pulverization, 39 Pumping unit, 109 R Radio frequency (RF), 238–239 Rapid prototyping (RP), 187, 239, 357–359 Raster scan, focused ion beam milling, 147, 148f Re-circulating pump, 46–47 Rectangular pulsed supply voltage with cathodic tool, 499–500 waveform, 501–502 Refresh time, 147 Resistance, 472 Resistance-capacitance (RC) relaxation circuit, 171 Resistance overpotential, 395 Reverse engineering (RE), 74–75 Reverse flow path, 407, 408f Reverse osmosis (RO) plant, 543 Reynolds number, 403 RF. See Radio frequency (RF) Root mean square, 712–713, 739 Rotary impulse circuit, 170–174, 174f Rotary ultrasonic face milling (RUFM), 38 Index 759Rotary ultrasonic machining (RUM), 24, 26, 35–36, 49–50, 50–51f abrasive bonded tool in, 28 advantages, 68–69 applications of, 69–70 coolant supply unit, 51–52 data acquisition unit, 51 on dental ceramics, 75–76, 76f fundamental principle of, 26f limitations, 69 material removal mechanism, 37–40, 38f operation types for milling, 24 process parameters, 62, 63f cutting force, 66–67, 67f material removal rate, 63–66, 64–65f surface roughness, 66, 66f tool vibration unit, 50–51 Rotating plate (RP), 736–737 S SCD. See Single crystal diamond (SCD) Screen printing technique, 372–373 Semiconductor diode laser, 271–272, 278 Semiconductor fabrication industries, 377–378 Sequential micromachining (SMM) processes, 652 advantages and challenges, 664–665 applications, 665–667 development, 657–662 energy efficiency oriented, 656 finishing the previously machined components, 664 machined surface quality oriented, 655 machining time oriented, 655 mechanism, 652–656 microstructure improvement oriented, 656 micro tool making oriented processes, 654 process capabilities of, 663–664 shaping an object, 663 in situ manufacturing of micro tool, 663 Serpentine scan, focused ion beam milling, 147, 148f Servo feed control, 178–179, 178f Servo feed mechanism, 178–180 Shallow trench isolation (STI), 701–702 Shape complexity of job, 4, 4f Shaped tube electrolyte machining (STEM), 431 Shielding gas, 249 Silicon carbide (SiC), 88–90, 97, 549, 682–683, 694–696, 716–718, 724–726, 735f, 739 Silicon-controlled rectifiers (SCR), 406 Silicon nitride (SiN), 301, 694–695, 732–733 Single crystal diamond (SCD), 734, 736–737, 736f, 739 Single laser beam, 307, 312–317 Single lens focused ion beam (FIB) system, 137 Single pulse drilling, 292–294, 348 Single water jet (SWJ), 121 Sinusoidal annulus microchannels, 154f Sinusoidal pulsed supply voltage waveform, 497–499 Sinusoidal pulsed voltage, 501 Slotting method, 702–704, 703f Sodium bicarbonate, 88–90 Sodium chloride, 412 Sodium hydroxide, 376–377 Sodium nitrate, 412, 469–471 Sodium nitride, 482 Sodium nitrite, 469–471 Sonic-Mill Manual, 43–44 Spark assisted chemical engraving (SACE), 537 Spark radius, 192 Spin-on glass (SOG), 691 Spiral scan, focused ion beam milling, 147, 148f Spot size, 145 Sputtering, 126–127 Sputtering rate (S), 129 Sputtering yield, 141 incident angle on, 144, 144f ion energy on, 143, 143f Stainless steel, 411 Stand-off distance (SOD), 93–95, 94f, 548–549, 549f Stationary ultrasonic machining, 25, 40, 40–41f abrasive slurry supply unit, 46–47 advantages, 67–68 760 Indexapplications of, 69 fundamental principle, 25f limitations, 68 material removal mechanism, 28–37, 29f mill module upper portion, 47–48, 47f power supply unit, 48–49 process parameters circularity error, 59–62 material removal rate, 52–55, 53–55f overcut criteria, 55–59, 56f, 58f and process criteria, 52, 52f setup specification, 49 tool feeding and control unit, 47–48 tool vibration unit, 41–45, 42f workpiece holding unit, 45–46, 45–46f Steady state gap, 498–499 Steigerwald gun configuration, 335f Steigerwald type electron gun, 335 STI. See Shallow trench isolation (STI) Stimulated emission, 266–268, 270, 273, 275–276, 278 Stopping and range of ions in matter (SRIM), 150 Straight flow path, 407, 407f Stray machining, 410–411, 410f Suction flushing, 181–185, 183f Suitable etching solution, 374 Super fine particles (SWC), 621, 623f Super finishing techniques, 18 Surface engineering, 119 Surface finish, for machining processes, 15, 16f, 18 Surface integrity, 6, 201–203, 417–418 Surface roughness incident angle on, 145f machining time on, 146, 146f rotary ultrasonic machining process parameters on, 66, 66f Synthetic sapphire, 109–110 T Tantalum, 631–632, 632f Taper, 200, 200f Taper cutting system, in wire electrical discharge machining, 213–214 Taylor cone, 134–135 Telescope, 709 Thermal energy, 163–164 Thermal interaction, 464 Thermal micromachining, 599–601 Thermal spalling phenomena, 518 Thermoelectric machining, 11t 3D electrochemical micromachining, 639 Threshold specific processing energy, 128–129 Through mask electrochemical micromachining, 636–637 Through-material etching, 374 Through-silicon via (TSVs), 707 Titanium, 431–432 Titanium alloy, 295–296, 300–301, 510 Tool electrode, electrical discharge machining fabrication and design, 187 materials, 185 tool wear, 185–186, 186f Tool feed rate circularity error of larger diameter, 62, 62f overcut of larger diameter, 58–59, 58f stationary ultrasonic machining, 47–48, 55, 55f Tool vibration unit rotary ultrasonic machining, 50–51 stationary ultrasonic machining, 41–44, 42f coupler, 43 hexagonal tool, 44–45, 44–45f horn, 43 transducer, 41 tubular tool, 43–44, 44–45f Tool wear electrical discharge machining, 185–186, 186f electrochemical discharge machining, 519–520 Tool wear ratio (TWR), 195 Traditional machining process, 3, 6 Transducer, 41 magnetostrictive effect, 42 piezoelectric, 41 ultrasonic, 24–25 Transistor type controlled pulse circuit, 174, 175f Transport of ions in matter (TRIM), 150 Transverse excited atmospheric pressure, 274–275 Index 761Transverse feed rate, 113, 114f Traveling wire electrochemical discharge machining (TWECDM), 539 Trim cutting, in wire electrical discharge machining, 219 Tubular tool, 43–44, 44–45f TV shadow aperture masks, 380, 381f 2D slice-by-slice method, 154 Two ways abrasive flow finishing process, 679–680, 680f TWR. See Tool wear ratio (TWR) U Ultra high pressure (UHP), 550–551 Ultra-large-scale integrated (ULSI), 690, 701–702, 707 Ultra precision finishing techniques, 18 Ultrasonically assisted abrasive flow machining (UAAFM), 688 Ultrasonic assisted electric discharge machining (UEDM), 15–16 Ultrasonic machining (USM), 10, 23, 511, 558, 597 advantages, 67–69 applications of, 69–70 developed tool, 70–71, 71f, 74–75, 75f discovery of, 23 drilled hexagonal hole, 71, 72f drilled hole entrance and exit, 72, 73f fundamentals of, 24–26, 25–26f hemispherical cavity developed tool and, 74–75, 76f on hydroxyapatite bio-ceramic, 72–74, 74f on workpiece, 72–74, 74f limitations of, 67–69 material removal mechanism, 28–40, 29f, 38f vs. micro ultrasonic machining, 606–607, 607t need of, 27–28 operating parameters, 49t rotary (see Rotary ultrasonic machining (RUM)) square stepped tool and hole on zirconia, 70–71, 71f stationary (see Stationary ultrasonic machining) stepped hole on zirconia, 70, 71f tooling material, 27 tools, 23, 43 types of, 24 with/without coating, 71–72, 73f Ultrasonic transducer, 24–25 Ultrasonic vibratory-rotary tool unit, 50–51 Ultraviolet (UV), 267–268, 275–276 Under liquid laser beam machining (UL-LBM), 328 United Kingdom Atomic Energy Authority (UKAEA), 24 Universal product codes (UPC), 317–318 V Variable frequency drive (VFD), 682 Vibration assisted advanced machining, 558–570 Vibration-assisted electro-discharge machining (VAEDM), 561 Vibration assisted mechanical machining, 558–560 Voltage-current waveform, 175–177, 176f Volumetric removal rate (VRR), 396, 472, 480 W Water injected plasma torch, 251, 252f Water injection plasma cutting method, 244–245 Water jet machining (WJM), 5, 10, 106–107, 108–109f, 111–112f, 597 abrasive, 540–552 advancement in, 120–121 advantages, 116 applications cutting operation, 117 deburring operation, 118 drilling operation, 118 removing road stripes, 119 stripping of cable insulation, 119 surface engineering, 119 catcher, 111 laser assisted, 575–576 limitations, 117 762 Indexmaterial removal mechanisms, 107–108 nozzle, 109 process parameters on machining criteria, 112–113, 112t nozzle diameter effect, 115 nozzle tip distance effect, 114, 115f number of passes effect, 115 transverse feed rate effect, 113, 114f water pressure effect, 113, 113–114f pumping unit, 109 working fluid, 110 Water pressure effect, 113, 113f Water-to-water heat exchanger, 287 White lead, 374–375 Wire bending, 224 Wire electrical discharge machining (WEDM), 5, 378, 443–444, 560–564, 562f advancement in, 228 applications of, 229 coated wire electrode, 219–221 components, 205–208, 206f composite wire for, 220–221, 221f corners and radii during corner cutting, 217–218, 218f dielectric supply system, 207, 207f features of, 204–205 finishing and accuracy, 215–219 forces acting on wire electrodes, 203–229, 215f Kerf width, 216, 217f mathematical modeling, 211–213 principle, 203–205, 204f process parameters, influence of, 208–211, 209f static deflection of wire, 226, 226f stratified wire for, 220, 220f taper cutting system in, 213–214 trim cutting features in, 219 wire lag corner cutting in, 227–228, 227f wire-lag phenomenon, 224–228 wire tool vibration, 222–224, 223f Wire electrochemical machining (WECM), 439–446, 440f, 456, 639–640, 645f basic scheme of, 440f fabricated micro slits, 445f fabricated micro square helix, 445f Wire electrode, 204–205, 208–210, 214–216, 219–222, 224, 228–229 Wire electro discharge grinding (WEDG), 615, 618 Wire lag corner cutting, 227–228, 227f Wire-lag phenomenon, 224–228 Wire tension (Wt), 209–210, 223 Wire trail-off, 218 Wire vibration, 222–224, 223f Working fluid, water jet machining, 110 Workpiece holding unit, 45–46, 45–46f Y Ytterbium doped fiber laser system, 288–289 Yttrium aluminum garnet (YAG), 283 Z Zinc-coated brass wire, 229 Zirconia bio-ceramic material square stepped tool and hole on, 70–71, 71f stepped hole on, 70, 71f Zirconium oxide ceramics, micro-drilling of, 294 Index 763MODERN MACHINING TECHNOLOGY ADVANCED , HYBRID, MICRO MACHINING AND SUPER FINISHING TECHNOLOGY By Bijoy Bhattacharyya and Biswanath Doloi Complex and precise components with challenging shapes are in rising demand from industry, increasing the relevance of advanced machining technology to more people than ever before. Modern Machining Technology is the first book to cover all major technologies in this field. Readers will find the latest technical developments and research in one place, allowing easy comparison of specifications. Technologies covered include mechanical, thermal, chemical, micro, and hybrid machining processes, as well as the latest advanced finishing technologies. Each topic is accompanied by a basic overview , examples of typical applications, studies of performance criteria, comparative advantages, and some model questions and solutions. Key Features • Addresses a broad range of modern machining techniques in detail, providing specifications for easy comparison • Includes descriptions of the main applications for each method, which materials or products they are used with • Provides the very latest research in progress including micro, hybrid, and sequential machining as well as super finishing methods
كلمة سر فك الضغط : books-world.net The Unzip Password : books-world.net أتمنى أن تستفيدوا من محتوى الموضوع وأن ينال إعجابكم رابط من موقع عالم الكتب لتنزيل كتاب Modern Machining Technology رابط مباشر لتنزيل كتاب Modern Machining Technology ![](https://i.servimg.com/u/f61/15/36/74/14/sign_110.gif)
|
|