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عدد المساهمات : 2041 التقييم : 3379 تاريخ التسجيل : 21/01/2012 العمر : 47 الدولة : مصر العمل : مدير الصيانة بشركة تصنيع ورق الجامعة : حلوان
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تذكير بمساهمة فاتح الموضوع : أخوانى فى الله أحضرت لكم كتاب Handbook of Ion Beam Processing Technology Principles, Deposition, Film Modification and Synthesis Jerome J. Cuomo and Stephen M. Rossnagel Ibm Thomas J. Watson Research Center Yorktown Heights, New York Harold R. Kaufman Front Range Research Fort Collins, Colorado and Commonwealth Scientific Corporation Alexandria, Virginia
![كتاب Handbook of Ion Beam Processing Technology - صفحة 2 H_o_i_11](https://i.servimg.com/u/f61/15/36/74/14/h_o_i_11.jpg) و المحتوى كما يلي :
Contents 1. Perspective on Past, Present and Future Uses of Ion Beam Technology 1 Jerome J. Cuomo, Stephen M. Rossnagel and Harold R. Kaufman 1.1 Introduction 1 1.2 Past Technology 2 1.3 Present Capabilities 2 1.3.1 Ion Beam Technology 2 1.3.2 Sputtering Phenomena 3 1.3.3 Film Deposition, Modification and Synthesis 3 1.4 Future Trends 4 1.5 References 5 Part I Ion Beam Technology 2. Gridded Broad-beam Ion Sources 8 Harold R. Kaufman and Raymond S. Robinson 2.1 Introduction 8 2.2 General Description 9 2.3 Discharge Chamber 11 2.4 Ion Optics 13 2.5 Production Applications 16 2.6 Target Contamination 16 2.7 Concluding Remarks 19 2.8 References 20 3. Electron Cyclotron Resonance (Ecr) Ion Sources 21 William M. Holber 3.1 Introduction 21 3.2 Theory of Operation 22 3.3 Types of Sources and Characteristics 26 3.4 Etching 30 Xixii Contents 3.5 Deposition 33 3.6 References 36 4. Hall Effect Ion Sources 39 Raymond S. Robinson and Harold R. Kaufman 4.1 Introduction 39 4.2 End-hall Ion Source 40 4.2.1 Operation 40 4.2.2 Ion Acceleration 42 4.2.3 Beam Energy Distribution 43 4.2.4 Beam Current Density Profile 46 4.3 Closed Drift Ion Source 48 4.3.1 Operation 49 4.3.2 Ion Acceleration 50 4.3.3 Beam Energy Distribution 51 4.3.4 Beam Current Density Profile 53 4.4 Concluding Remarks 53 4.5 References 54 5. Ionized Cluster Beam (Icb) Deposition and Epitaxy 58 Isao Yamada and Toshinori Takagi 5.1 Introduction 58 5.2 Experiment 59 5.2.1 Principles of Icb Operation 59 5.3 Aspects of Film Deposition With Icb 64 5.3.1 Kinetic Energy Range of Icb and Effects of the Kinetic Energy 67 5.3.2 Effects of the Ionic Charge 70 5.3.3 Film Deposition by Reactive Icb Techniques 70 5.3.4 Film Deposition by Simultaneous Use of Icb and Microwave Ion Sources 72 5.4 Summary 74 5.5 References 75 Part Ii Sputtering Phenomena 6. Quantitative Sputtering 78 Peer C. Zalm 6.1 Introduction 78 6.2 Total Sputter Yield Considerations 79 6.2.1 Polycrystalline and Amorphous Elemental Targets 79 6.2.2 Predictions From Linear Cascade Theory 81 6.2.3 Exceptions to Predictions From Linear Cascade Theory 82 6.2.4 Ion Effects: the Direct Knock-on Regime 83 6.2.5 Ion Effects: Due to I-iigh Fluence 84 6.2.6 Ion Effects: Reactive and Molecular Ions 84 6.2.7 Target Effects: Temperature 85 6.2.8 Target Effects: Single Crystal Targets 86 6.2.9 Target Effects: Multicomponent Materials 87contents Xiii 6.3 Differential Sputter Yield Considerations 87 6.3.1 Angular Distributions of Sputtered Particles 87 6.3.2 Energy Distributions of Sputtered Particles 89 6.4 Experimental Considerations for Sputter Yield Measurements 93 6.4.1 Ion Beam 93 6.4.2 Sputtering Target 95 6.4.3 Measurement Techniques 95 6.5 Total Sputter Yield Measurements 96 6.5.1 Mass Loss Techniques 96 6.5.2 Probe Techniques 97 6.5.3 Thickness Change Techniques 98 6.5.3.1 Masking Techniques 98 6.5.3.2 Optical Methods 100 6.5.3.3 Thin Film Interface Techniques 100 6.5.3.4 Other Techniques 100 6.6 Differential Yield Measurements: Angular and Energy Distributions 101 6.6.1 Angular Distributions of Ejected Particles 101 6.6.2 Energy Distributions of Ejected Particles 102 6.6.3 Combined Angular- and Energy-resolved Measurements 104 6.7 Concluding Remarks 105 6.8 References 106 7. Laser-induced Fluorescence as a Tool for the Study Of Ion Beam Sputtering 112 Wallis F. Calaway, Charles E. Young, Michael J. Pellin, and Dieter M. Gruen 7.1 Introduction 112 7.2 Experimental Technique 113 7.3 Summary of Data 116 7.3.1 Sputtering Yields 116 7.3.2 Velocity Distributions 118 7.3.3 Oxide Coverage and Adsorbates 121 7.3.4 Sputtering of Alloys and Nonmetallic Compounds 123 7.4 Conclusion 124 7.5 References 125 8. Characterization of Atoms Desorbed From Surfaces By Ion Bombardment Using Multiphoton Ionization Detection 128 David L. Pappas, Nicholas Winograd and Fred M. Kimock 8.1 Introduction 128 8.2 Analytical Applications 129 8.3 Energy and Angle Measurements 134 8.4 Nonresonant Multiphoton Ionization 138 8.5 Conclusion 140 8.6 References 142 9. The Application of Postionization for Sputtering Studies and Surface or Thin Film Analysis 145 Hans Oechsnerxiv Contents 9.1 Introduction 145 9.2 Postionization Techniques Using Penning Processes 146 9.3 Electron Gas Postionization in Low Pressure Plasmas 148 9.3.1 Investigations of the Sputtering Process by Plasma Postionization 149 9.3.2 Electron Gas Postionization for Secondary Neutral Mass Spectrometry Snms 156 9.4 Summary 164 9.5 References 165 Part Iii Film Modification and Synthesis 10. The Modification of Films by Ion Bombardment 170 Eric Kay and Stephen M. Rossnagel 10.1 Introduction 170 10.2 Experimental Concerns for Bombardment-modification of Films 171 10.3 Effects on Film Properties by Energetic Bombardment 175 10.3.1 Physical Effects 175 10.3.1.1 Grain Size 175 10.3.1.2 Orientation 175 10.3.1.3 Nucleation Density 176 10.3.1.4 Defects 176 10.3.1.5 Lattice Distortion 178 10.3.1.6 Surface Diffusion 179 10.3.1.7 Density 180 10.3.1.8 Epitaxial Temperature 181 10.3.1.9 Film Stress 181 10.3.1.10 Surface Topography 182 10.3.1.11 Implantation of Gas Atoms 184 10.3.1.12 Optical Properties 184 10.3.1.13 Resistivity 184 10.3.2 Chemical Effects 185 10.3.2.1 Stoichiometry 185 10.4 Reactive Film Deposition 187 10.4.1 Reactive Ion Beam Deposition 187 10.4.2 Reactive Deposition by Dual Ion Beam Synthesis: Ain 187 10.4.3 Reactive Ion Beam Assisted Evaporation: Cu-o Compounds 188 10.4.4 Optical Films by Ion Beam Assisted Deposition 190 10.5 Summary 190 10.6 References 190 11. Control of Film Properties by Ion-assisted Deposition Using Broad Beam Sources 194 Ronnen a. Roy and Dennis S. Vee 11.1 Introduction 194 11.2 Property Changes 194 11.2.1 Ion Energy Effects 194contents Xv 11.2.2 Temperature Effects 199 11.3 Film Structure Modification 201 11.3.1 Ion Energy Effects 201 11.3.2 Temperature Effects 202 11.3.3 Structure-property Relations 205 11.4 General Discussion of Ion Bombardment Mechanisms 210 11.4.1 Materials and Temperature Effects 213 11.4.2 Property Optimization 216 11.5 References 217 12. Etching With Directed Beams 219 Michael Geis, Stella W. Pang, Nicholas E. Efremow, George a. Lincoln, Gerald D. Johnson and William D. Goodhue 12.1 Introduction 219 12.2 Ion Beam Assisted Etching 219 12.3 Etching Gaas 221 12.4 Etching Diamond 230 12.5 Hot Jet Etching 231 12.6 Etching Damag" 236 12.7 Summary 237 12.8 References 238 13. Film Growth Modification by Concurrent Ion Bombardment: Theory and Simulation 241 Karl-heinz Muller 13.1 Introduction 241 13.2 Film Microstructure, the Role of Impact Mobility and Substrate Temperature 242 13.2.1 Classification of Film Structure in Terms of Zones 242 13.2.2 the Henderson Model and Zone-1 Structure 242 13.2.3 Thermal Mobility and the Zone-1-zone-2 Transition 244 13.2.4 Origin of the Zone-2 Structure 245 13.3 Ion Bombardment Induced Structural Modifications During Film Growth 247 13.3.1 the Thermal-spike Approach 247 13.3.2 the Collision-cascade Approach 249 13.3.2.1 Redeposition Mechanism 249 13.3.2.2 Densification Mechanism 249 13.3.2.3 Critical and Optimum Ion-to-atom Arrival Rate Ratios 257 13.3.2.4 Film Orientation 259 13.3.3 the Molecular-dynamics Approach 260 13.3.3.1 Vapor Phase Growth 260 13.3.3.2 Vapor and Sputter Deposition 262 13.3.3.3 Ion-assisted Deposition 262 13.3.3.4 Intrinsic Stress Modification 267 13.3.3.5 Ion-beam Deposition 270 13.3.3.6 Ionized-cluster-beam Deposition 271 13.6 Conclusions 274 13.7 References 274xvi Contents 14. Interface Structure and Thin Film Adhesion 279 John Baglin 14.1 Introduction 279 14.2 Factors Affecting Adhesion 279 14.3 Ion Beam Techniques 281 14.4 Interface Stitching 283 14.4.1 Adhesion Enhancement 283 14.4.2 Examples of Stitching 287 14.4.3 Stitching Mechanisms 288 14.4.4 Contaminant Dispersion 289 14.4.5 Applicability of Stitching 291 14.5 Low Energy Ion Sputtering 291 14.5.1 Adhesion Enhancement 292 14.5.2 Adhesion Mechanism 292 14.6 Implantation and Adsorption 295 14.7 Ion Assisted Deposition 296 14.8 Summary 296 14.9 References 297 15. Modification of Thin Films by Off-normal Incidence Ion Bombardment 300 R. Mark Bradley 15.1 Introduction 300 15.2 Modification of Crystal Structure by Off-normal Incidence Ion Bombardment 300 15.2.1 Effect of Bombardment After Deposition 300 15.2.2 Effect of Bombardment During Deposition 301 15.3 Topography Changes Induced by Off-normal Incidence Ion Bombardment 307 15.3.1 Overview 307 15.3.2 Ripple Topography Induced by Off-normal Incidence Ion Bombardment 307 15.4 Summary 312 15.5 References 313 16. Ion Beam Interactions With Polymer Surfaces 315 Robert C. White and Paul S. Ho 16.1 Introduction 315 16.2 High and Medium Energy Ions 317 16.3 Sims Studies of Polymers 320 16.4 Xps Studies 326 16.5 Summary 336 16.6 References 336 17. Topography: Texturing Effects 338 Bruce a. Banks 17.1 Introduction 338 17.2 Ion Beam Sputter Texturing Processes and Effects 338 17.2.1 Natural Texturing 339 17.2.1.1 Chemically Pure Materials 339contents Xvii 17.2.2 Seed Texturing 346 17.2.2.1 Seed Materials 346 17.2.2.2 Diffusion Effects 348 17.2.2.3 Resulting Topographies 350 17.2.3 Shadow Masking 353 17.3 Textured Surface Properties 355 17.3.1 Mechanical 355 17.3.2 Electrical 357 17.3.3 Chemical 357 17.3.4 Optical 358 17.4 References 359 18. Methods and Techniques of Ion Beam Processes 362 Stephen M. Rossnagel 18.1 Introduction 362 18.2 Ion Beam Sputtering (Ibs) 362 18.2.1 Comparison to Rf Sputtering 365 18.3 Ion Beam Sputter Deposition 366 18.4 Ion Beam Assisted Deposition (Ibad) 368 18.5 Dual Ion Beam Sputtering (Dibs) 370 18.6 Ion Assisted Bombardment: Other Techniques 371 18.6.1 Ionized Cluster Beam 371 18.6.2 Hollow Cathode Magnetron Techniques 371 18.7 Summary 371 18.8 References 372 19. Ion-assisted Dielectric and Optical Coatings 373 Phil J. Martin and Roger P. Netterfield 19.1 Introduction 373 19.2 Microstructure of Thin Films 373 19.2.1 Microstructure and Optical Properties 376 19.3 Effects of Ion Bombardment on Film Properties 378 19.3.1 Microstructure 378 19.3.2 Adhesion and Stress 381 19.3.3 Compound Synthesis 382 19.3.4 Crystal Structure and Stoichiometry 382 19.3.5 Scattering 383 19.3.6 Optimum Parameters for Ion-assisted Film Deposition 384 19.3.7 Summary 387 19.4 Ion-assisted Techniques 387 19.4.1 Ion-assisted Deposition 387 19.4.2 Ion Plating 389 19.4.3 Sputtering 390 19.4.3.1 Ion Beam Sputtering (Ibs) 390 19.4.3.2 Magnetron Sputtering 390 19.4.4 Ionized Cluster Beam Deposition (Icb) 391 19.5 Optical Properties of Ion-assisted Films 392 19.5.1 Oxides 393 19.5.1.1 Silicon Dioxide 393 19.5.1.2 Aluminum Oxide 393xvi Ii Contents 19.5.1.3 Titanium Dioxide 395 19.5.1.4 Zirconium Dioxide 397 19.5.1.5 Cerium Dioxide 400 19.5.1.6 Tantalum Pentoxide 401 19.5.1.7 Vanadium Dioxide 402 19.5.2 Fluorides 404 19.5.3 Conducting Transparent Films 404 19.5.4 Nitrides 405 19.6 Conclusion 407 19.7 References 407 20. Diamond and Diamond-like Thin Films by Ion Beam Techniques 415 Makoto Kitabatake and Kiyotaka Wasa 20.1 Introduction 415 20.2 Principle of Diamond Synthesis 416 20.2.1 Conventional Synthesis 416 20.2.2 Synthesis From the Gas Phase 419 20.3 Experimental Techniques 420 20.4 Diamond-like Films 422 20.4.1 Characterization 422 20.4.2 Discussion 425 20.4.3 Applications 427 20.5 Diamond Particles 429 20.5.1 Characterization 429 20.5.2 Discussion 432 20.6 Conclusion 433 20.7 References 433 Index
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